Development of 30 μm pitch Cu/Ni/SnAg micro-bump-bonded chip-on-chip (COC) interconnects

International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings

Volumn , Issue , 2010, Pages

  Juang, Jing Ye ^a   Lu, Su Tsai ^a   Zhan, Chau Jie ^a   Su Ching, Chung ^a   Fan, Chia Wen ^a   Peng, Jong Shiou ^a   Chen, Tai Hong ^a  

^a INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ASSEMBLY PROCESS; ASSEMBLY TECHNOLOGY; BONDING PROCESS; CHIP-ON-CHIP; ELECTRICAL TESTS; FILLER CONTENTS; GAP CONTROL; GAP FILLING; MICRO-BUMPS; MICRO-JOINT; MICROSTRUCTURE ANALYSIS; PRE-CONDITIONING; QUALITY CHECKS; RELIABILITY PERFORMANCE; RELIABILITY TEST; TEMPERATURE CYCLING TESTS; UNDERFILL MATERIALS; UNDERFILLS; VOID FORMATION; VOLUME SHRINKAGE;

CHIP SCALE PACKAGES; FAILURE MODES; FILLING; MICROSYSTEMS; RELIABILITY ANALYSIS; THREE DIMENSIONAL;

QUALITY ASSURANCE;

EID: 79951623144     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IMPACT.2010.5699628     Document Type: Conference Paper

References (8)

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