Feasibility of atomic layer etching of polymer material based on sequential O2 exposure and Ar low-pressure plasma-etching

Applied Physics Letters

Volumn 102, Issue 25, 2013, Pages

  Vogli, Evelina ^a   Metzler, Dominik ^a,b   Oehrlein, Gottlieb S ^a  

^a UNIVERSITY OF MARYLAND   (United States)

^b TU DORTMUND UNIVERSITY   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ATOMIC LAYER ETCHING; ETCHING CHAMBER; ETCHING STEP; POLYMER MATERIALS; POLYSTYRENE POLYMERS; REACTIVE LAYERS; SELF-LIMITED ETCHING; SEQUENTIAL DEPOSITION;

COATED WIRE ELECTRODES; DEPOSITION; PLASMA ETCHING;

POLYMERS;

EID: 84879850077     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.4812750     Document Type: Article

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