Intermetallic compound formation and evolution in solid-state Sn/Immersion-Ag/Cu trilayer interfacial reactions on a flexible polymer board

Journal of Electronic Materials

Volumn 38, Issue 6, 2009, Pages 908-914

  Lin, Chi Pu ^a   Chen, Chih Ming ^a  

^a NATIONAL CHUNG HSING UNIVERSITY   (Taiwan)

Author keywords

Immersion Ag; Interfacial reaction; Solid state bonding; Surface finishing

Indexed keywords

FLEXIBLE POLYMERS; IMMERSION AG; INTERFACIAL REACTION; INTERFACIAL REACTIONS; INTERMETALLIC COMPOUNDS; JOINT INTERFACES; OPTOELECTRONIC PACKAGING; PB-FREE; SN-BASED SOLDERS; SOLDER JOINTS; SOLID-STATE BONDING; SURFACE FINISHING; THREE PHASIS; TRILAYER; VOID FORMATION;

BRAZING; INTERMETALLICS; LEAD; PHASE INTERFACES; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT MANUFACTURE; SILVER; SOLDERING ALLOYS; SOLID STATE REACTIONS; THERMAL AGING; WELDING;

TIN;

EID: 67650439000     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-009-0778-3     Document Type: Conference Paper

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