Thermal characterization of cloud workloads on a power-efficient server-on-chip

Proceedings - IEEE International Conference on Computer Design: VLSI in Computers and Processors

Volumn , Issue , 2012, Pages 175-182

  Milojevic, Dragomir ^a   Idgunji, Sachin ^c   Jevdjic, Djordje ^b   Ozer, Emre ^c   Lotfi Kamran, Pejman ^b   Panteli, Andreas ^b   Prodromou, Andreas ^b   Nicopoulos, Chrysostomos ^b   Hardy, Damien ^b   Falsari, Babak ^b   Sazeides, Yiannakis ^b  

^a IMEC   (Belgium)

^b EPFL   (Switzerland)

^c ARM LTD   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

COOLING SOLUTIONS; DATA CENTERS; EMBEDDED CORES; LOWER ENERGIES; MANY-CORE; MEMORY BANDWIDTHS; OFF-CHIP; OVERALL COSTS; PHYSICAL PROTOTYPING; POWER DENSITIES; POWER EFFICIENT; THERMAL CHARACTERIZATION; THROUGH SILICON VIAS;

COSTS; DATA TRANSFER; HEAT SINKS; THERMOANALYSIS; THREE DIMENSIONAL COMPUTER GRAPHICS;

DYNAMIC RANDOM ACCESS STORAGE;

EID: 84872092486     PISSN: 10636404     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICCD.2012.6378637     Document Type: Conference Paper

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