DRAM-on-logic stack - Calibrated thermal and mechanical models integrated into PathFinding flow

Proceedings of the Custom Integrated Circuits Conference

Volumn , Issue , 2011, Pages

  Milojevic, Dragomir ^a   Oprins, Herman ^a   Ryckaert, Julien ^a   Marchal, Paul ^a   Van Der Plas, Geert ^a  

^a IMEC   (Belgium)

Author keywords

3D; Characterization; Design flow

Indexed keywords

3D; 3D TECHNOLOGY; DESIGN AND TECHNOLOGY; DESIGN FLOW; DESIGN FLOWS; EXPERIMENTAL DATA; MEASUREMENT RESULTS; MECHANICAL CHARACTERIZATIONS; MECHANICAL MODEL; PATHFINDING; SUPPORT SYSTEMS;

DESIGN; INTEGRATED CIRCUIT MANUFACTURE; INTEGRATED CIRCUITS; INTEGRATION; SYSTEMS ANALYSIS; THREE DIMENSIONAL;

LOGIC CIRCUITS;

EID: 80455168169     PISSN: 08865930     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/CICC.2011.6055357     Document Type: Conference Paper

References (8)

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