Interaction of Sn-based Solders with Ni(P) Substrates: Phase Equilibria and Thermochemistry

Lead-free Solders: Materials Reliability for Electronics

Volumn , Issue , 2012, Pages 71-118

  Schmetterer, Clemens ^a   Ganesan, Rajesh ^b   Ipser, Herbert ^c  

^a TU BERGAKADEMIE FREIBERG   (Germany)

^b INDIRA GANDHI CENTRE FOR ATOMIC RESEARCH   (India)

^c UNIVERSITY OF VIENNA   (Austria)

Author keywords

Binary phase diagrams of Ni Sn; CALPHAD type optimizations; Nickel phosphide enthalpy; P Sn phase diagram; Sn based solders; Ternary compounds; Thermochemical data

Indexed keywords

BINARY ALLOYS; BINARY MIXTURES; GIBBS FREE ENERGY; PHASE DIAGRAMS; PHASE EQUILIBRIA; PHOSPHORUS; SOLDERING; SOLDERING ALLOYS; TERNARY SYSTEMS;

BINARY PHASE DIAGRAMS; CALPHAD; NICKEL PHOSPHIDE; SN-BASED SOLDERS; TERNARY COMPOUNDS; THERMOCHEMICAL DATA;

NICKEL COMPOUNDS;

EID: 84870370988     PISSN: None     EISSN: None     Source Type: Book    
DOI: 10.1002/9781119966203.ch4     Document Type: Chapter

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