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Volumn 39, Issue 3, 2010, Pages 283-294

Detailed phase evolution of a phosphorous-rich layer and formation of the Ni-Sn-P compound in Sn-Ag-Cu/electroplated Ni-P solder joints

(3) Lin, Yung Chi a Wang, Kai Jheng a Duh, Jenq Gong a

a NATIONAL TSING HUA UNIVERSITY (Taiwan)

Author keywords

Lead free solder; Ni Sn P phase; P rich phase

Indexed keywords

ANALYTICAL TRANSMISSION ELECTRON MICROSCOPY; EPMA; FIELD-EMISSION ELECTRONS; INTERFACIAL MICROSTRUCTURE; LAYER COMPOUNDS; LEAD FREE SOLDERS; MICROSCOPIC CHARACTERIZATION; PHASE EVOLUTIONS; PHASE FORMATIONS; RICH PHASE; SELECTED AREA DIFFRACTION; SOLDER JOINTS; SOLDER MATRIX; TEM; UNDER BUMP METALLIZATION;

ELECTRON PROBE MICROANALYSIS; EPITAXIAL GROWTH; LEAD; MECHANICAL PROPERTIES; PHASE DIAGRAMS; PHOSPHORUS; SCANNING ELECTRON MICROSCOPY; SILVER; SOLDERING ALLOYS; TRANSMISSION ELECTRON MICROSCOPY;

TIN;

EID: 77951023143 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-009-1014-x Document Type: Article

Times cited : (44)

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