Optimal phosphorous content selection for the soldering reaction of Ni-P under bump metallization with Sn-Ag-Cu solder

Journal of Electronic Materials

Volumn 35, Issue 8, 2006, Pages 1665-1671

  Lin, Yung Chi ^a   Duh, Jenq Gong ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

Dissolution; Electroplated; Interfacial reaction; Lead free solder; Ni Sn P; Under bump metallurgy (UBM)

Indexed keywords

DISSOLUTION; ELECTROPLATING; INTERMETALLICS; METALLIZING; MICROELECTRONICS; SOLDERING; SOLDERING ALLOYS; SURFACE REACTIONS; TIN ALLOYS;

INTERFACIAL REACTION; LEAD FREE SOLDERS; NI-SN-P; UNDER BUMP METALLURGY (UBM);

PHOSPHORUS;

EID: 33748683758     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-006-0215-9     Document Type: Article

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