Effects of phosphorus content on the reaction of electroless Ni-P with Sn and crystallization of Ni-P

Journal of Electronic Materials

Volumn 33, Issue 7, 2004, Pages 790-795

  Sohn, Y C ^a   Yu, Jin ^a   Kang, S K ^b   Shih, D Y ^b   Choi, W K ^c  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

^b IBM T J WATSON RESEARCH CENTER   (United States)

^c Samsung Advanced Institute of Technology (SAIT)   (South Korea)

Author keywords

Electroless Ni P; P; Reaction; Sn

Indexed keywords

CORROSION RESISTANCE; CRYSTALLIZATION; INTERMETALLICS; METALLIZING; MICROSTRUCTURE; SOLDERING ALLOYS;

ELECTROLESS NI-P; INTERFACIAL REACTIONS; TRANSITION POINTS;

NICKEL COMPOUNDS;

EID: 3242660007     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-004-0243-2     Document Type: Article

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