Impression creep behaviour of tin based lead free solders

Materials Science and Technology

Volumn 20, Issue 7, 2004, Pages 885-890

  Rani, S Devaki ^a   Murthy, G S ^b  

^a JNTUH COLLEGE OF ENGINEERING   (India)

^b ANDHRA UNIVERSITY   (India)

Author keywords

Impression creep; Lead free; Power law creep; Solders; Toxicity

Indexed keywords

ACTIVATION ENERGY; CREEP; ENTHALPY; EUTECTICS; STRESSES; TIN ALLOYS; TOXICITY;

CREEP BEHAVIOR; LEAD FREE SOLDERS;

SOLDERING ALLOYS;

ALLOY; BISMUTH; LEAD; TIN; ZINC;

ARTICLE; CHEMICAL STRUCTURE; DIFFUSION; ELECTRONICS; ENTHALPY; HEATING; HIGH TEMPERATURE; LEACHING; POWER LAW CREEP; STEADY STATE; STRESS; TEMPERATURE DEPENDENCE; TOXICITY; VELOCITY;

EID: 3342979662     PISSN: 02670836     EISSN: None     Source Type: Journal    
DOI: 10.1179/026708304225017283     Document Type: Article

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