Rate-dependent indentation behavior of solder alloys

Journal of Materials Science

Volumn 40, Issue 8, 2005, Pages 1923-1928

  Wang, Feng Jiang ^a,b   Ma, Xin ^b   Qian, Yi Yu ^a  

^a HARBIN INSTITUTE OF TECHNOLOGY   (China)

^b Yik Shing Tat Industrial Co Ltd   (China)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; COPPER; CREEP; EUTECTICS; FINITE ELEMENT METHOD; INDENTATION; SILVER; STRAIN; TIN; VISCOPLASTICITY;

CREEP CHARACTERISTICS; INDENTATION BEHAVIOR; LOADING RATE; VISCO-PLASTIC INDENTATION;

SOLDERING ALLOYS;

EID: 17544372208     PISSN: 00222461     EISSN: None     Source Type: Journal    
DOI: 10.1007/s10853-005-1212-8     Document Type: Article

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