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Journal of Materials Science: Materials in Electronics

Volumn 21, Issue 3, 2010, Pages 262-269

Impression creep of the rare-earth doped Sn-2%Bi lead-free solder alloy

(4) Mahmudi, R a Geranmayeh, A R b Salehi, M a Pirayesh, H a

a UNIVERSITY OF TEHRAN (Iran)

b ISLAMIC AZAD UNIVERSITY (Iran)

Author keywords

[No Author keywords available]

Indexed keywords

CREEP BEHAVIORS; CREEP MECHANISM; CREEP RATES; DISLOCATION CREEP; DISLOCATION MOVEMENT; GRAIN REFINER; HIGH STRESS; IMPRESSION CREEP; INTER-METALLIC PARTICLE; LEAD-FREE SOLDER ALLOY; MATRIX; PUNCHING STRESS; RARE EARTH DOPED; SELF-DIFFUSION; SOLID SOLUTION HARDENING; STRENGTHENING AGENTS; STRESS EXPONENTS;

ACTIVATION ENERGY; CERIUM ALLOYS; CREEP; CREEP RESISTANCE; CREEP TESTING; INTERMETALLICS; LEAD; TIN ALLOYS;

TIN;

EID: 77949264297 PISSN: 09574522 EISSN: 1573482X Source Type: Journal
DOI: 10.1007/s10854-009-9903-6 Document Type: Article

Times cited : (13)

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