The strength of the silicon die in flip-chip assemblies

Journal of Electronic Packaging

Volumn 125, Issue 1, 2003, Pages 114-119

  Cotterell, B ^a   Chen, Z ^b   Han, J B ^c   Tan, N X ^c  

^a INSTITUTE OF MATERIALS RESEARCH AND ENGINEERING   (Singapore)

^b NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^c AGILENT TECHNOLOGIES   (Singapore)

Author keywords

Dicing defects; Grinding defects; Reliability; Silicon; Strength

Indexed keywords

CRACK INITIATION; CRACK PROPAGATION; FRACTURE TESTING; FRACTURE TOUGHNESS; MAXIMUM LIKELIHOOD ESTIMATION; PRINTED CIRCUIT BOARDS; RELIABILITY; SILICON WAFERS; STRENGTH OF MATERIALS; TENSILE STRESS; WEIBULL DISTRIBUTION;

DICING EFFECTS; FLIP CHIP ASSEMBLIES; GRINDING DEFECTS; SILICON DIE;

FLIP CHIP DEVICES;

EID: 0344119440     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1535934     Document Type: Article

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