A three-parameter Weibull-like fitting function for flip-chip die strength data

Microelectronics Reliability

Volumn 44, Issue 3, 2004, Pages 459-470

  Zhao, Jie Hua ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BENDING (DEFORMATION); COMPUTER SIMULATION; ELASTIC MODULI; FINITE ELEMENT METHOD; PROBABILITY DENSITY FUNCTION; SOLDERED JOINTS; STRENGTH OF MATERIALS; STRESS CONCENTRATION; TENSILE STRESS; THERMAL STRESS; WEIBULL DISTRIBUTION;

DIE CRACKING; DIE STRENGTH; MULTI-AXIAL STRESS;

FLIP CHIP DEVICES;

EID: 1142276081     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(03)00238-5     Document Type: Article

References (19)

1. Guo Y, Zhao J-H. A practical die stress model and its applications in flip-chip packages. In: Proceedings of the Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM 2000), 2000. p. 393-9.
2. Kittel C. Introduction to solid state physics. 5th ed. 1976;Wiley, New York.
3. Chengalva MK. Flip chip die cracking - a simplified approach utilizing experimentation and simulations. In: Proceedings of 2002 Inter Society Conference on Thermal Phenomena in Electronic Systems (ITHERM 2002), 2002. p. 876-83.
4. Weibull W. A statistical distribution function of wide applicability. J. Appl. Mech. 18:1951;293-297.
5. Fett T., Munz D., Thun G. Tensile and bending strength of piezoelectric ceramics. J. Mater. Sci. Lett. 18:1999;1899-1902.
6. Stanley P., Fessler H., Sivill A.D. An engineer's approach to the prediction of failure probability of brittle components. Proc. Brit. Ceram. Soc. 22:1973;453-487.
7. Stanley P., Sivill A.D., Fessler H. Application of the four function Weibull equation in the design of brittle components. Bradt R.C., Hasselman D.P.H., Lang F.F. Fracture mechanics of ceramics. 1978;51-65 Plenum Press, New York.
8. Stanley P., Inanc E.Y. Assessment of surface strength and bulk strength of a typical brittle material. Eggwertz S., Lind N.C. Probabilistic methods. I. The mechanics of solids and structures. 1985;231-251 Springer-Verlag, Berlin.
9. Margetson J., Cooper N.R. Brittle material design using three parameter Weibull distributions. Eggwertz S., Lind N.C. Probabilistic methods. I. The mechanics of solids and structures. 1985;254-262 Springer-Verlag, Berlin.
10. Duffy S.F., Powers L.M., Starlinger A. Reliability analysis of structural ceramic components using a three-parameter Weibull distribution. Tran. ASME J. Eng. Gas Turbines Power. 115:1993;109-116.
11. Gross B. Least squares best fit method for the three parameter Weibull distribution: Analysis of tensile and bend specimens with volume or surface flaw failure. NASA Technical Memorandum 4721, NASA TM-4721, 1996.
12. Batdorf S.B., Crose J.G. A statistical theory for the fracture of brittle structure subjected to nonuniform polyaxial stresses. J. Appl. Mech. 41:1974;459-464.
13. Batdorf S.B., Heinisch H.L. Jr. Weakest link theory reformulated for arbitrary fracture criterion. J. Am. Ceram. Soc. 61:1978;355-358.
14. Gere J.M., Timoshenko S.P. Mechanics of materials. 3rd ed. 1990;PWS-KENT Publishing Company, Boston.
15. Yeung B, Hause V. Motorola internal reports, 2000 and 2001.
16. Starlinger A., Duffy S.F., Palko J. Parameter estimation techniques based on optimizing goodness-to-fit statistics for structure reliability. Schaller R. Reliability, stress analysis and failure prevention, The 1993 ASME Design Technical Conferences - 10th Biennial Conference on Reliability, Stress Analysis, and Failure Prevention. DE-vol. 55:1993;ASME, New York.
17. MATHEMATICA is a trademark of Wolfram Research, Inc. Chicago, IL.
18. Abernethy R.B. The new Weibull handbook. 3rd ed. 1998;Robert B. Abernethy, North Palm Beach, FL.
19. ANSYS Inc. ANSYS User's Manual. Available from 〈http://www.ansys.com〉.