Structure and mechanical properties of diamond-like carbon films with copper functional layer by cathode arc evaporation

Surface and Coatings Technology

Volumn 208, Issue , 2012, Pages 101-108

  Zhou, Bing ^a,b   Rogachev, A V ^a   Liu, Zhubo ^a   Jiang, Xiaohong ^b   Shen, Ruiqi ^b   Rudenkov, A S ^a  

^a FRANCISK SKORINA GOMEL STATE UNIVERSITY   (Belarus)

^b NANJING UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

Author keywords

Bilayer; Diamond like carbon; Diffusion; Functional layer; Morphology

Indexed keywords

ANNEALING TEMPERATURES; ARC EVAPORATION; BI-LAYER; BI-LAYER FILMS; CATHODE ARC PLASMA; CU INTERLAYERS; CU SURFACES; DIAMOND-LIKE CARBON; DIFFUSION LAYERS; DIRECT-CURRENT; ELEMENT DISTRIBUTION; ENGINEERING MATERIALS; FUNCTIONAL LAYER; HIGH MECHANICAL PROPERTIES; IN-VACUUM; LOWER STRESS; MORPHOLOGY AND MECHANICAL PROPERTIES; NANO-AGGLOMERATES; PARTICLE SIZE AND SURFACES; SILICON SUBSTRATES; SURFACE LAYERS; THREE-LAYER MODELS;

ANNEALING; CARBON CLUSTERS; CARBON FILMS; CATHODES; DIAMONDS; DIFFUSION; HARDNESS; MAGNETIC FILMS; MORPHOLOGY; SURFACE ROUGHNESS; SURFACES;

COPPER;

EID: 84866152051     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2012.08.024     Document Type: Article

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