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Journal of Applied Physics

Volumn 112, Issue 2, 2012, Pages

Electromigration induced failure on lead-free micro bumps in three-dimensional integrated circuits packaging

(4) Ouyang, Fan Yi a Hsu, Hao a Su, Yu Ping a Chang, Tao Chih b

a NATIONAL TSING HUA UNIVERSITY (Taiwan)

b INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP-ON-CHIP; ELECTROMIGRATION RESISTANCE; FLIP CHIP SOLDER JOINTS; LEAD-FREE; MICRO-BUMPS; THREE DIMENSIONAL INTEGRATED CIRCUITS;

CHIP SCALE PACKAGES; CURRENT DENSITY; INTEGRATED CIRCUITS; THREE DIMENSIONAL;

ELECTROMIGRATION;

EID: 84865446155 PISSN: 00218979 EISSN: None Source Type: Journal
DOI: 10.1063/1.4737154 Document Type: Article

Times cited : (37)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.