-
1
-
-
3242671509
-
A 90 nm high volume manufacturing logic technology featuring novel 45 nm gate length strained silicon CMOS transistors
-
T. Ghani, M. Armstrong, C. Auth, M. Bost, P. Charvat, G. Glass, T. Hoffmann, K. Johnson, C. Kenyon, J. Klaus, B. McIntyre, K. Mistry, A. Murthy, J. Sandford, M. Silberstein, S. Sivakumar, P. Smith, K. Zawadzki, S. Thompson, and M. Bohr, "A 90 nm high volume manufacturing logic technology featuring novel 45 nm gate length strained silicon CMOS transistors," in Proc. Int. Electron Device Meeting Tech. Dig., 2003, pp. 11.6.1-11.6.3.
-
(2003)
Proc. Int. Electron Device Meeting Tech. Dig.
, pp. 1161-1163
-
-
Ghani, T.1
Armstrong, M.2
Auth, C.3
Bost, M.4
Charvat, P.5
Glass, G.6
Hoffmann, T.7
Johnson, K.8
Kenyon, C.9
Klaus, J.10
McIntyre, B.11
Mistry, K.12
Murthy, A.13
Sandford, J.14
Silberstein, M.15
Sivakumar, S.16
Smith, P.17
Zawadzki, K.18
Thompson, S.19
Bohr, M.20
more..
-
2
-
-
50249177115
-
A highly scaled, high performance bulk CMOS technology with SRAM cell
-
C. Kuan-Lun, C. C. Wu, Y. P. Wang, D. W. Lin, C. M. Chu, Y. Y. Tarng, S. Y. Lu, S. J. Yang, M. H. Hsieh, C. M. Liu, S. P. Fu, J. H. Chen, C. T. Lin, W. Y. Lien, H. Y. Huang, P.W.Wang, H. H. Lin, D. Y. Lee, M. J. Huang, C. F. Nieh, L. T. Lin, C. C. Chen, W. Chang, Y. H.Chiu, M. Y. Wang,C.H.Yeh, F.C.Chen, Y. H. Chang, S.C.Wang, H. C. Hsieh,M. D. Lei, K. Goto, H. J. Tao, M. Cao, H. C. Tuan, C. H. Diaz, Y. J. Mii, and C. M. Wu, "A highly scaled, high performance bulk CMOS technology with SRAM cell," in Proc. Int. Electron Device Meeting Tech. Dig., 2007, pp. 243-246.
-
(2007)
Proc. Int. Electron Device Meeting Tech. Dig.
, pp. 243-246
-
-
Kuan-Lun, C.1
Wu, C.C.2
Wang, Y.P.3
Lin, D.W.4
Chu, C.M.5
Tarng, Y.Y.6
Lu, S.Y.7
Yang, S.J.8
Hsieh, M.H.9
Liu, C.M.10
Fu, S.P.11
Chen, J.H.12
Lin, C.T.13
Lien, W.Y.14
Huang, H.Y.15
Wang, P.W.16
Lin, H.H.17
Lee, D.Y.18
Huang, M.J.19
Nieh, C.F.20
Lin, L.T.21
Chen, C.C.22
Chang, W.23
Chiu, Y.H.24
Wang, M.Y.25
Yeh, C.H.26
Chen, F.C.27
Chang, Y.H.28
Wang, S.C.29
Hsieh, H.C.30
Lei, M.D.31
Goto, K.32
Tao, H.J.33
Cao, M.34
Tuan, H.C.35
Diaz, C.H.36
Mii, Y.J.37
Wu, C.M.38
more..
-
3
-
-
0036927879
-
The impact of technology scaling on soft error rate performance and limits to the efficacy of error correction
-
R. Baumann, "The impact of technology scaling on soft error rate performance and limits to the efficacy of error correction," in Proc. Int. Electron Device Meeting, 2002, pp. 329-332.
-
(2002)
Proc. Int. Electron Device Meeting
, pp. 329-332
-
-
Baumann, R.1
-
4
-
-
17644440390
-
Neutron soft error rate measurements in a 90-nm CMOS process and scaling trends in SRAM from 0.25-pm to 90-nm generation
-
P. Hazucha, T. Karnik, J. Maiz, S. Walstra, B. Bloechel, J. Tschanz, G. Dermer, S. Hareland, P. Armstrong, and S. Borkar, "Neutron soft error rate measurements in a 90-nm CMOS process and scaling trends in SRAM from 0.25-pm to 90-nm generation," in Proc. Int. Electron Device Meeting Tech. Dig., 2003, pp. 21.5.1-21.5.4.
-
(2003)
Proc. Int. Electron Device Meeting Tech. Dig.
, pp. 2151-2154
-
-
Hazucha, P.1
Karnik, T.2
Maiz, J.3
Walstra, S.4
Bloechel, B.5
Tschanz, J.6
Dermer, G.7
Hareland, S.8
Armstrong, P.9
Borkar, S.10
-
5
-
-
0033314263
-
Soft error considerations for deep-submicron CMOS circuit applications
-
N. Cohen, T. S. Sriram, N. Leland, D. Moyer, S. Butler, and R. Flatley, "Soft error considerations for deep-submicron CMOS circuit applications," in Proc. Int. Electron Device Meeting Tech. Dig., 1999, pp. 315-318. (Pubitemid 30574473)
-
(1999)
Technical Digest - International Electron Devices Meeting
, pp. 315-318
-
-
Cohen Neil1
Sriram, T.S.2
Leland Norm3
Moyer David4
Butler Steve5
Flatley Robert6
-
6
-
-
77957924174
-
Comprehensive study of soft errors in advanced CMOS circuits with 90/130 nm technology
-
Y. Tosaka, H. Ehara, M. Igeta, T. Uemura, H. Oka, N. Matsuoka, and K. Hatanaka, "Comprehensive study of soft errors in advanced CMOS circuits with 90/130 nm technology," in Proc. Int. Electron Device Meeting Tech. Dig., 2004, pp. 38.3.1-38.3.4.
-
(2004)
Proc. Int. Electron Device Meeting Tech. Dig.
, pp. 3831-3834
-
-
Tosaka, Y.1
Ehara, H.2
Igeta, M.3
Uemura, T.4
Oka, H.5
Matsuoka, N.6
Hatanaka, K.7
-
7
-
-
39049112433
-
Spreading diversity in multi-cell neutron-induced upsets with device scaling
-
DOI 10.1109/CICC.2006.321010, 4114997, Proceedings of the IEEE 2006 Custom Integrated Circuits Conference, CICC 2006
-
I. Eishi, S. S. Chung, W. ShiJie, Y. Hironaru, Y. Yasuo, K. Hideaki, Y. Shigehisa, and A. Takashi, "Spreading diversity in multi-cell neutron-induced upsets with device scaling," in Proc. Custom Integrated Circuits Conf., San Jose, CA, 2006, pp. 437-444. (Pubitemid 351246408)
-
(2006)
Proceedings of the Custom Integrated Circuits Conference
, pp. 437-444
-
-
Ibe, E.1
Chung, S.S.2
Wen, S.3
Yamaguchi, H.4
Yahagi, Y.5
Kameyama, H.6
Yamamoto, S.7
Akioka, T.8
-
8
-
-
64549089982
-
High performance Hi-K + metal gate strain enhanced transistors on (110) silicon
-
P. Packan, S. Cea, H. Deshpande, T. Ghani,M. Giles, O. Golonzka,M. Hattendorf, R. Kotlyar, K. Kuhn, A. Murthy, P. Ranade, L. Shifren, C. Weber, and K. Zawadzki, "High performance Hi-K + metal gate strain enhanced transistors on (110) silicon," in Proc. Int. Electron Device Meeting Tech. Dig., 2008, pp. 1-4.
-
(2008)
Proc. Int. Electron Device Meeting Tech. Dig.
, pp. 1-4
-
-
Packan, P.1
Cea, S.2
Deshpande, H.3
Ghani, T.4
Giles, M.5
Golonzka, O.6
Hattendorf, M.7
Kotlyar, R.8
Kuhn, K.9
Murthy, A.10
Ranade, P.11
Shifren, L.12
Weber, C.13
Zawadzki, K.14
-
9
-
-
0036957352
-
SEU sensitivity of bulk and SOI technologies to14-MeV neutrons
-
Dec.
-
G. Gasiot, V. Ferlet-Cavrois, J. Baggio, P. Roche, P. Flatresse, A. Guyot, P. Morel, O. Bersillon, and J. du Port de Pontcharra, "SEU sensitivity of bulk and SOI technologies to14-MeV neutrons," IEEE Trans. Nucl. Sci., vol. 49, no. 6, pp. 3032-3037, Dec. 2002.
-
(2002)
IEEE Trans. Nucl. Sci.
, vol.49
, Issue.6
, pp. 3032-3037
-
-
Gasiot, G.1
Ferlet-Cavrois, V.2
Baggio, J.3
Roche, P.4
Flatresse, P.5
Guyot, A.6
Morel, P.7
Bersillon, O.8
Du Port De Pontcharra, J.9
-
10
-
-
0034450511
-
Impact of CMOS technology scaling on the atmospheric neutron soft error rate
-
DOI 10.1109/23.903813, PII S0018949900111967
-
P. Hazucha and C. Svensson, "Impact of CMOS technology scaling on the atmospheric neutron soft error rate," IEEE Trans. Nucl. Sci., vol. 47, no. 6, pp. 2586-2594, Dec. 2000. (Pubitemid 32321347)
-
(2000)
IEEE Transactions on Nuclear Science
, vol.47
, Issue.6
, pp. 2586-2594
-
-
Hazucha, P.1
Svensson, C.2
-
11
-
-
34250777043
-
Radiation-induced soft error rates of advanced CMOS bulk devices
-
DOI 10.1109/RELPHY.2006.251220, 4017161, 2006 IEEE International Reliability Physics Symposium Proceedings, 44th Annual
-
N. Seifert, P. Slankard, M. Kirsch, B. Narasimham, V. Zia, C. Brookreson, A. Vo, S. Mitra, B. Gill, and J. Maiz, "Radiation induced soft error rates of advanced CMOS bulk devices," in Proc. Int. Reliability Physics Symp., 2006, pp. 217-225. (Pubitemid 46964519)
-
(2006)
IEEE International Reliability Physics Symposium Proceedings
, pp. 217-225
-
-
Seifert, N.1
Slankard, P.2
Kirsch, M.3
Narasimham, B.4
Zia, V.5
Brookreson, C.6
Vo, A.7
Mitra, S.8
Gill, B.9
Maiz, J.10
-
12
-
-
0035309017
-
Device simulation study of the SEU sensitivity of SRAMs to internal ion tracks generated by nuclear reactions
-
DOI 10.1109/23.915368, PII S0018949901027320
-
J.-MPalau, G. Hubert, K. Coulie, B. Sagnes, M.-C Calvet, and S. Fourtine, "Device simulation study of the SEU sensitivity of SRAMs to internal ion tracks generated by nuclear reactions," IEEE Trans. Nucl. Sci., vol. 48, no. 2, pp. 225-231, Apr. 2001. (Pubitemid 32371576)
-
(2001)
IEEE Transactions on Nuclear Science
, vol.48
, Issue.2
, pp. 225-231
-
-
Palau, J.-M.1
Hubert, G.2
Coulie, K.3
Sagnes, B.4
Calvet, M.-C.5
Fourtine, S.6
-
13
-
-
72349100573
-
Laser-induced current transients in strained-Si Diodes
-
Dec.
-
P. Hyunwoo, D. J. Cummings, R. Arora, J. A. Pellish, R. A. Reed, R. D. Schrimpf, D. McMorrow, S. E. Armstrong, U. Roh, T. Nishida, M. E. Law, and S. E. Thompson, "Laser-induced current transients in strained-Si Diodes," IEEE Trans. Nucl. Sci., vol. 56, no. 6, pp. 3203-3209, Dec. 2009.
-
(2009)
IEEE Trans. Nucl. Sci.
, vol.56
, Issue.6
, pp. 3203-3209
-
-
Hyunwoo, P.1
Cummings, D.J.2
Arora, R.3
Pellish, J.A.4
Reed, R.A.5
Schrimpf, R.D.6
McMorrow, D.7
Armstrong, S.E.8
Roh, U.9
Nishida, T.10
Law, M.E.11
Thompson, S.E.12
-
14
-
-
33846310741
-
Alpha-induced multiple cell upsets in standard and radiation hardened SRAMs manufactured in a 65 nm CMOS technology
-
DOI 10.1109/TNS.2006.885007
-
G. Gasiot, D. Giot, and P. Roche, "Alpha-induced multiple cell upsets in standard and radiation hardened SRAMs manufactured in a 65 nm CMOS technology," IEEE Trans. Nucl. Sci., vol. 53, no. 6, pp. 3479-3486, Dec. 2006. (Pubitemid 46113352)
-
(2006)
IEEE Transactions on Nuclear Science
, vol.53
, Issue.6
, pp. 3479-3486
-
-
Gasiot, G.1
Giot, D.2
Roche, P.3
-
15
-
-
37249088963
-
Multiple cell upsets as the key contribution to the total ser of 65 nm CMOS SRAMs and its dependence on well engineering
-
DOI 10.1109/TNS.2007.908147
-
G. Gasiot, D. Giot, and P. Roche, "Multiple cell upsets as the key contribution to the total SER of 65 nm CMOS SRAMs and its dependence on well engineering," IEEE Trans. Nucl. Sci., vol. 54, no. 6, pp. 2468-2473, Dec. 2007. (Pubitemid 350274107)
-
(2007)
IEEE Transactions on Nuclear Science
, vol.54
, Issue.6
, pp. 2468-2473
-
-
Gasiot, G.1
Giot, D.2
Roche, P.3
-
16
-
-
79959285226
-
Analysis of multiple cell upsets due to neutrons in SRAMs for a deep-N-Well process
-
N. Mahatme, B. Bhuva, Y. Fang, and A. Oates, "Analysis of multiple cell upsets due to neutrons in SRAMs for a deep-N-Well process," in Proc. Int. Reliability Physics Symp., 2011, pp. SE.7.1-SE.7.6.
-
(2011)
Proc. Int. Reliability Physics Symp.
-
-
Mahatme, N.1
Bhuva, B.2
Fang, Y.3
Oates, A.4
-
17
-
-
0033332804
-
Charge deposition modeling of thermal neutron products in fast submicron MOS devices
-
X.W. Zhu, L.W. Massengill, C. R. Cirba, and H. J. Barnaby, "Charge deposition modeling of thermal neutron products in fast submicron MOS devices," IEEE Trans. Nucl. Sci., vol. 46, no. 6, pp. 1378-1385, Dec. 1999. (Pubitemid 30574237)
-
(1999)
IEEE Transactions on Nuclear Science
, vol.46
, Issue.6
, pp. 1378-1385
-
-
Zhu, X.W.1
Massengill, L.W.2
Cirba, C.R.3
Barnaby, H.J.4
-
18
-
-
84865376502
-
-
V. Deglahal, Ph.D. dissertation, Pennsylvania State Univ., State College, 2003
-
V. Deglahal, Ph.D. dissertation, Pennsylvania State Univ., State College, 2003.
-
-
-
-
19
-
-
58849091394
-
Characterizing SRAM single event upset in terms of single and multiple node charge collection
-
Dec.
-
J. Black, D. R. Ball, W.H. Robinson,D.M. Fleetwood, R.D. Schrimpf, R.A.Reed, D. A.Black, K. M. Warren,A.D. Tipton, P. E. Dodd,N. F. Haddad, M. A. Xapsos, H. S. Kim, and M. Friendlich, "Characterizing SRAM single event upset in terms of single and multiple node charge collection," IEEE Trans. Nucl. Sci., vol. 55, no. 6, pp. 2943-2947, Dec. 2008.
-
(2008)
IEEE Trans. Nucl. Sci.
, vol.55
, Issue.6
, pp. 2943-2947
-
-
Black, J.1
Ball, D.R.2
Robinson, W.H.3
Fleetwood, D.M.4
Schrimpf, R.D.5
Reed, R.A.6
Black, D.A.7
Warren, K.M.8
Tipton, A.D.9
Dodd, P.E.10
Haddad, N.F.11
Xapsos, M.A.12
Kim, H.S.13
Friendlich, M.14
-
20
-
-
72349086145
-
Single-event upsets andmultiple-bit upsets on a 45 nm SOI SRAM
-
Dec.
-
D. F. Heidel, P.W.Marshall, J. A. Pellish, K. P. Rodbell, K. A. LaBel, J. R. Schwank, S. E. Rauch, M. C. Hakey, M. D. Berg, C. M. Castaneda, P. E. Dodd,M. R. Friendlich, A. D. Phan, C. M. Seidleck, M. R. Shaneyfelt, andM. A. Xapsos, "Single-event upsets andmultiple-bit upsets on a 45 nm SOI SRAM," IEEE Trans. Nucl. Sci., vol. 56, no. 6, pp. 3499-3503, Dec. 2009.
-
(2009)
IEEE Trans. Nucl. Sci.
, vol.56
, Issue.6
, pp. 3499-3503
-
-
Heidel, D.F.1
Marshall, P.W.2
Pellish, J.A.3
Rodbell, K.P.4
Label, K.A.5
Schwank, J.R.6
Rauch, S.E.7
Hakey, M.C.8
Berg, M.D.9
Castaneda, C.M.10
Dodd, P.E.11
Friendlich, M.R.12
Phan, A.D.13
Seidleck, C.M.14
Shaneyfelt, M.R.15
Xapsos, M.A.16
-
21
-
-
84932102670
-
SRAM ser in 90, 130 and 180 nm bulk and SOI technologies
-
E.H.Cannon, D. D.Reinhardt, M. S. Gordon, and P. S.Makowenskyj, "SRAM SER in 90, 130 and 180 nm bulk and SOI technologies," in Proc. IEEE Int. Reliability Physics Symp., 2004, pp. 300-304.
-
(2004)
Proc. IEEE Int. Reliability Physics Symp.
, pp. 300-304
-
-
Cannon, E.H.1
Reinhardt, D.D.2
Gordon, M.S.3
Makowenskyj, P.S.4
-
22
-
-
77955819393
-
Radiation evaluation of ST test structures in commercial 130 nm CMOS bulk and SOI, in commercial 90 nm CMOS bulk and in commercial 65 nm CMOS bulk and SOI
-
Jan.
-
P. Roche and R. Harboe-Sorensen, "Radiation evaluation of ST test structures in commercial 130 nm CMOS bulk and SOI, in commercial 90 nm CMOS bulk and in commercial 65 nm CMOS bulk and SOI," in Proc. Euro. Space Agency QCA Workshop, Jan. 2006.
-
(2006)
Proc. Euro. Space Agency QCA Workshop
-
-
Roche, P.1
Harboe-Sorensen, R.2
|