Irreversible thermodynamics of triple junctions during the intergranular void motion under the electromigration forces

International Journal of Solids and Structures

Volumn 42, Issue 13, 2005, Pages 3918-3952

  Ogurtani, Tarik Omer ^a   Oren, Ersin Emre ^a  

^a MIDDLE EAST TECHNICAL UNIVERSITY   (Turkey)

Author keywords

Damage mechanics; Diffusion; Electromigration; Interconnect failure; Interfaces and surfaces; Thermodynamics; Void growth

Indexed keywords

BOUNDARY VALUE PROBLEMS; COMPUTER SIMULATION; DIFFUSION; ELECTROMIGRATION; ENTROPY; FAILURE (MECHANICAL); GRAIN BOUNDARIES; INTERFACES (MATERIALS); MATERIALS SCIENCE; METALLIC FILMS; MICROSTRUCTURE; POLYCRYSTALS; THIN FILMS;

DAMAGE MECHANICS; INTERCONNECT FAILURE; INTERFACES AND SURFACES; SURFACE CONTAMINATION; VOID GROWTH;

THERMODYNAMICS;

EID: 13544252829     PISSN: 00207683     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijsolstr.2004.11.013     Document Type: Article

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