Thermal management challenges in telecommunication systems and data centers

IEEE Transactions on Components, Packaging and Manufacturing Technology

Volumn 2, Issue 8, 2012, Pages 1307-1316

  Garimella, Suresh V ^a   Yeh, Lian Tuu ^b   Persoons, Tim ^a,c  

^a PURDUE UNIVERSITY   (United States)

^b HUAWEI TECHNOLOGIES   (United States)

^c TRINITY COLLEGE DUBLIN   (Ireland)

Author keywords

Central office; communication networks; energy management; thermal management of electronics

Indexed keywords

CENTRAL OFFICES; COOLING SOLUTIONS; DATA CENTERS; ENERGY USAGE; LIQUID COOLING; MANAGEMENT CHALLENGES; MULTI-DISCIPLINARY DESIGNS; SYSTEM LEVELS; TELECOM; THERMAL MANAGEMENT SYSTEMS; TOTAL COST OF OWNERSHIP;

ENERGY MANAGEMENT; ENERGY UTILIZATION; MANAGEMENT; TELECOMMUNICATION NETWORKS; TEMPERATURE CONTROL;

TRACKING (POSITION);

EID: 84864670082     PISSN: 21563950     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCPMT.2012.2185797     Document Type: Review

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