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Volumn , Issue , 2009, Pages 1-
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Temperature as a first-class citizen in chip design
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Author keywords
[No Author keywords available]
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Indexed keywords
3-D INTEGRATION;
CIRCUIT EFFECTS;
ELEVATED TEMPERATURE;
IN-CHIP;
MOORE'S LAW;
NEW TECHNOLOGIES;
ON CHIPS;
THERMAL DESIGNS;
THERMAL MANAGEMENT;
PACKAGING;
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EID: 71749104679
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
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Times cited : (3)
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References (0)
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