Novel heat transfer fluids using mixture formulations for electronics thermal management

2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010

Volumn , Issue , 2010, Pages

  Sathyanarayana, Aravind ^a   Joshi, Yogendra ^a   Im, Yunhyeok ^b  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^b Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

Heat transfer enhancement; Nano structured surface; Pool boiling

Indexed keywords

CHEMICAL COMPATIBILITY; COPPER NANOWIRES; ELECTRONIC COMPONENT; ELECTRONIC DEVICE; FLUID MIXTURES; HEAT TRANSFER ENHANCEMENT; HEAT TRANSFER FLUIDS; HEAT TRANSFER PROPERTIES; LIQUID COOLANT; LOW THERMAL CONDUCTIVITY; MIXTURE FORMULATION; NANOSTRUCTURED SURFACE; PHASE CHANGE HEAT TRANSFER; POOL BOILING; SATURATION CONDITIONS; SILICON SUBSTRATES; TEST SURFACES; THERMAL MANAGEMENT; THERMAL PERFORMANCE; THERMAL PROPERTIES;

COOLANTS; ELECTRONICS ENGINEERING; ETHERS; HEAT TRANSFER COEFFICIENTS; LAKES; LIQUIDS; METHANOL; MIXED CONVECTION; MIXTURES; NANOSTRUCTURES; THERMAL VARIABLES CONTROL; THERMODYNAMIC PROPERTIES;

HEAT EXCHANGERS;

EID: 77955215584     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ITHERM.2010.5501354     Document Type: Conference Paper

References (8)

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3. Simons, R.E., Direct Liquid Immersion Cooling for High Power Density Microelectronics, Electronics Cooling, 1996, 2 (2): pp. 1-6.
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6. Arik M., Bar-Cohen A., Ebullient Cooling of Integrated Circuits by Novec Fluids, Technical Report GRC027, 2002, GE Global Research.
7. Im,Y., Copper Nanowire and Flower-like CuO Nanostructure Surfaces for Enhanced Boiling, (2009) Thesis (PhD), Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology.
8. Im,Y., Joshi,Y., Dietz,C., Lee,S.S., Enhanced boiling of a dielectric liquid on copper nanowire surfaces, International Journal of Micro-Nano Scale Transport, Vol. 1, 2010.