A novel hybrid heat sink using phase change materials for transient thermal management of electronics

IEEE Transactions on Components and Packaging Technologies

Volumn 28, Issue 2, 2005, Pages 281-289

  Krishnan, Shankar ^a   Garimella, Suresh V ^a   Kang, Sukhvinder S ^b  

^a PURDUE UNIVERSITY   (United States)

^b Aavid Thermalloy   (United States)

Author keywords

Electronics cooling; Hybrid heat sinks; Melting; Phase change materials (PCMs); Transient power dissipation

Indexed keywords

COOLING; FINS (HEAT EXCHANGE); HEAT CONVECTION; HEAT LOSSES; HEAT SINKS; MELTING; PHASE TRANSITIONS; SEMICONDUCTOR MATERIALS; THERMODYNAMIC PROPERTIES;

ELECTRONICS COOLING; HYBRID HEAT SINK; PHASE CHANGE MATERIALS (PCMS); TRANSIENT POWER DISSIPATION; TRANSIENT THERMAL MANAGEMENT;

ELECTRONICS PACKAGING;

EID: 21044459528     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2005.848534     Document Type: Article

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