Open side car heat exchanger that removes entire server heat load without any added fan power

2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010

Volumn , Issue , 2010, Pages

  Schmidt, Roger ^a   Iyengar, Madhu ^a   Porter, Don ^a   Weber, Gerry ^a   Graybill, David ^a   Steffes, James ^a  

^a IBM   (United States)

Author keywords

Data center; Heat exchanger; IT infrastructure supporting hardware; Side car; Water cooled

Indexed keywords

DATA CENTER; DATA CENTERS; IT INFRASTRUCTURE SUPPORTING HARDWARE; IT INFRASTRUCTURES; SIDE CAR;

AIR; AIR INTAKES; AMPLIFIERS (ELECTRONIC); AUTOMOBILE PARTS AND EQUIPMENT; COMPUTER HARDWARE; ELECTRONICS ENGINEERING; FLOORS; HEAT EXCHANGERS; OSCILLATORS (ELECTRONIC); THERMAL LOAD;

AUTOMOBILE ELECTRONIC EQUIPMENT;

EID: 77955203825     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ITHERM.2010.5501423     Document Type: Conference Paper

References (6)

1. ASHRAE, "Thermal Guidelines for Data Processing Equipment-second edition", 2008, available from http://tc99.ashraecs.org/
2. Schmidt, R., "Effect of Data Center Characteristics on Data Processing Equipment Inlet Temperatures", Advances in Electronic Packaging 2001(Proceedings of IPACK '01, The Pacific Rim/ASME International Electronic Packaging Technical Conference and Exhibition), Vol. 2, Paper IPACK2001-15870, Kauai, Hawaii, July 8-13, 2001, pp. 1097-1106.
3. Flotherm 4.2 reference manual, www.flotherm.com. Performance",
4. R. Schmidt, R. Chu, V. Kamath, M. Ellsworth, M. Iyengar, D. Porter, and B. Lehman, 2005, "Maintaining Datacomm rack Inlet Temperatures with water Cooled heat Exchangers", Proceedings of the Pacific Rim/ASME International Electronic Packaging Technical Conference (InterPACK), Paper number IPACK2005-73468, July 17-22, San Francisco, California.
5. R. Schmidt and M. Iyengar, 2009, 2009, "Server Rack Rear Door Heat Exchanger and the New ASHRAE Recommended Environmental Guidelines", Proceedings of the Pacific Rim/ASME International Electronic Packaging Technical Conference (InterPACK), Paper number IPACK2009-89212, July 2009.
6. T. Tsukamoto, J. Takayoshi, R. Schmidt, and M. Iyengar, 2009, "Refrigeration Heat Exchanger Systems for Server Rack Cooling in Data Centers", Proceedings of the Pacific Rim/ASME International Electronic Packaging Technical Conference (InterPACK), Paper number IPACK2009-89258, July 2009.