A corrosion investigation of solder candidates for high-temperature applications

JOM

Volumn 61, Issue 6, 2009, Pages 59-65

  Chidambaram, Vivek ^a   Hald, John ^a   Ambat, Rajan ^a   Hattel, Jesper ^a  

^a TECHNICAL UNIVERSITY OF DENMARK   (Denmark)

Author keywords

[No Author keywords available]

Indexed keywords

BULK SOLDER; CALPHAD APPROACH; CORROSION-RESISTANT; EUTECTIC COMPOSITION; LEAD-FREE; MULTI-CHIP MODULE TECHNOLOGIES;

CORROSION; GERMANIUM; LEAD; SOLDERING; SOLDERING ALLOYS; TIN; TIN ALLOYS;

BINARY ALLOYS;

EID: 70349734665     PISSN: 10474838     EISSN: 15431851     Source Type: Journal    
DOI: 10.1007/s11837-009-0089-4     Document Type: Article

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