Thermal oxidation study on lead-free solders of Sn-Ag-Cu and Sn-Ag-Cu-Ge

Advanced Engineering Materials

Volumn 8, Issue 1-2, 2006, Pages 111-114

  Cho, Song Wan ^a   Han, Kyul ^a   Yi, Yeonjin ^a   Kang, Seong Jun ^a   Yoo, Kyung Hwa ^a   Jeong, Kwangho ^a   Whang, Chung Nam ^a  

^a Yonsei University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

LEAD; SURFACE REACTIONS; TERNARY SYSTEMS; THERMOOXIDATION; X RAY PHOTOELECTRON SPECTROSCOPY;

LEAD-FREE SOLDERS; REFLOW PROCESS; RELIABILITY TESTS;

SOLDERING ALLOYS;

EID: 33644616275     PISSN: 14381656     EISSN: None     Source Type: Journal    
DOI: 10.1002/adem.200500188     Document Type: Article

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