Electrochemical behavior of a new solder material (Sn-In-Ag)

Materials Letters

Volumn 57, Issue 28, 2003, Pages 4368-4371

  Oulfajrite, H ^a   Sabbar, A ^b   Boulghallat, M ^a   Jouaiti, A ^a   Lbibb, R ^a   Zrineh, A ^b  

^a SULTAN MOULAY SLIMANE UNIVERSITY   (Morocco)

^b MOHAMMED V UNIVERSITY   (Morocco)

Author keywords

Electrochemical behavior; Sn In Ag; Solder material

Indexed keywords

CORROSION RESISTANCE; ELECTROCHEMISTRY; TERNARY SYSTEMS;

ELECTRONIC ASSEMBLIES;

SOLDERING ALLOYS;

EID: 0141838945     PISSN: 0167577X     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-577X(03)00326-4     Document Type: Article

References (13)

1. Jin S. JOM. 45:1993;13.
2. Vianco P.T., Frear D.R. JOM. 45:1993;14.
3. Winterbollon W.L. JOM. 45:1993;20.
4. Melton C. JOM. 45:1993;33.
5. McCormack C., Jin S. JOM. 45:1993;36.
6. J.A. Slattery, C.E.T. White, US Patent number 5256370, 1994.
7. Wood E.P., Nimmo K.L. J. Electron. Mater. 23(8):1994;709-713.
8. Korhonen T.M., Kivilathi J.K. J. Electron. Mater. 27(3):1998;149-158.
9. Frear D.R. J. Metals. 48(5):1996;49-53.
10. Artaki I., Jackson A.M., Vianco P.T. J. Electron. Mater. 23(8):1994;757-764.
11. Choi W.K., Lee H.M. J. Korean Phys. Soc. 35:1999;340-344.
12. Sabbar, El Hajjaj, Ben Bachir A., Alaoui-Belghiti M., Zrineh A. Mater. Corros. 52:2001;298-301.
13. Delouis C., Dupral M., Toumillon C. J. Electroanal. Chem. 181:1984;119.