Multi-scale modeling of direct copper plating on resistive non-copper substrates

Electrochimica Acta

Volumn 78, Issue , 2012, Pages 524-531

  Yang, Liu ^a,b   Radisic, Aleksandar ^a   Nagar, Magi ^a,c   Deconinck, Johan ^b   Vereecken, Philippe M ^a,d   West, Alan C ^e  

^a IMEC   (Belgium)

^b VRIJE UNIVERSITEIT BRUSSEL   (Belgium)

^c GHENT UNIVERSITY   (Belgium)

^d UNIVERSITY OF LEUVEN   (Belgium)

^e Department of Earth and Environmental Sciences   (United States)

Author keywords

Coalescence thickness; Copper; Direct plating; Multi scale modeling; Nucleation

Indexed keywords

COLLECTIVE EFFECTS; CURRENT DISTRIBUTION; DIRECT PLATING; FRONT PROPAGATION; HIGH NUCLEATION DENSITY; INPUT CURRENT; MACRO SCALE; MICRO-SCALES; MULTI-SCALE MODELING; NUCLEATION MODELS; PLATING PROCESS; RESISTIVE SUBSTRATES; SUBSTRATE CONDUCTIVITY; THICKNESS PROFILES; WAFER EDGE;

COALESCENCE; COPPER; COPPER PLATING; NUCLEATION;

SUBSTRATES;

EID: 84864282291     PISSN: 00134686     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.electacta.2012.06.076     Document Type: Article

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