Multiscale simulations of copper electrodeposition onto a resistive substrate

IBM Journal of Research and Development

Volumn 49, Issue 1, 2005, Pages 49-63

  Drews, Timothy O ^a   Krishnan, Sriram ^b   Alameda Jr , Jay C ^a   Gannon, Dennis ^b   Braatz, Richard D ^a   Alkire, Richard C ^a  

^a UNIVERSITY OF ILLINOIS AT URBANA CHAMPAIGN   (United States)

^b INDIANA UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; COPPER; MATHEMATICAL MODELS; MONTE CARLO METHODS; MORPHOLOGY; SUBSTRATES; SURFACE ROUGHNESS;

COPPER ELECTRODEPOSITION; MONTE CARLO CODES; ROUGHNESS EVOLUTION;

ELECTRODEPOSITION;

EID: 13844275833     PISSN: 00188646     EISSN: None     Source Type: Journal    
DOI: 10.1147/rd.491.0049     Document Type: Article

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