Uniformity effects when electrodepositing Cu onto resistive substrates in the presence of organic additives

Journal of the Electrochemical Society

Volumn 155, Issue 4, 2008, Pages

  Willey, Mark J ^a,b   Emekli, Ugur ^a   West, Alan C ^a,b  

^a Columbia University ^*  (United States)

^b ELECTROCHEMICAL SOCIETY

Author keywords

[No Author keywords available]

Indexed keywords

ADDITIVES; COPPER; ELECTROCHEMICAL ELECTRODES; PLATINUM; SUBSTRATES; THIN FILMS;

BIS(3-SULFOPROPYL DISULFIDE); ELECTROPLATING ADDITIVES; ORGANIC ADDITIVES; UNIFORMITY EFFECTS;

ELECTROPLATING;

EID: 40549141519     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.2837857     Document Type: Article

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