Tailoring copper island density for copper plating on a RuTa substrate

ECS Transactions

Volumn 28, Issue 29, 2010, Pages 9-16

  Nagar, M ^a,b   Vereecken, P M ^a,c   Radisic, A ^a   Strubbe, K ^b  

^a IMEC   (Belgium)

^b GHENT UNIVERSITY   (Belgium)

^c UNIVERSITY OF LEUVEN   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

BINARY ALLOYS; RUTHENIUM ALLOYS;

APPLIED CURRENT; BATH COMPOSITIONS; COPPER CONCENTRATION; DEPOSITION PARAMETERS; ELECTROCHEMICAL NUCLEATION; GALVANOSTATIC METHODS; ISLAND DENSITY; PLATING BATH;

TANTALUM ALLOYS;

EID: 79959525267     PISSN: 19385862     EISSN: 19386737     Source Type: Conference Proceeding    
DOI: 10.1149/1.3502439     Document Type: Conference Paper

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