Copper plating on resistive substrates, diffusion barrier and alternative seed layers

ECS Transactions

Volumn 25, Issue 27, 2009, Pages 175-184

  Radisic, A ^a   Nagar, M ^a,b   Strubbe, K ^b   Armini, S ^a   El Mekki, Z ^a   Volders, H ^a   Ruythooren, W ^a   Vereecken, P M ^a  

^a IMEC   (Belgium)

^b GHENT UNIVERSITY   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

BINARY ALLOYS; CYCLIC VOLTAMMETRY; DIFFUSION BARRIERS; ELECTROCHEMICAL DEPOSITION; NANOCOMPOSITE FILMS; REDUCTION; RUTHENIUM ALLOYS; SUBSTRATES;

CO-SUBSTRATE; DIRECT PLATING; GALVANOSTATIC METHODS; RESISTIVE SUBSTRATES; SEED LAYER; SINGLE-STEP; TA FILMS; TANTALUM (TA);

TANTALUM ALLOYS;

EID: 79952765282     PISSN: 19385862     EISSN: 19386737     Source Type: Conference Proceeding    
DOI: 10.1149/1.3318516     Document Type: Conference Paper

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