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Volumn 520, Issue 19, 2012, Pages 6095-6099

Evolution of microstructure and electrical conductivity of electroless copper deposits on a glass substrate

(3) Cui, Xiaoyun a Hutt, David A a Conway, Paul P a

a LOUGHBOROUGH UNIVERSITY (United Kingdom)

Author keywords

Copper; Deposition rate; Electrical conductivity; Electroless deposition; Glass substrate; Microstructure; Scanning electron microscopy

Indexed keywords

CONSTANT LEVEL; COPPER FILMS; DUAL BEAM; ELECTRICAL CONDUCTIVITY; ELECTROLESS COPPER; ELECTROLESS COPPER DEPOSITION; ELECTRONICS MANUFACTURE; EVOLUTION OF THE MICROSTRUCTURE; FIELD EMISSION SCANNING ELECTRON MICROSCOPES; GLASS SUBSTRATES; GRAIN SIZE; INITIAL DEPOSITIONS; PRE-TREATMENT; TRIMETHOXYSILANE;

ATOMIC FORCE MICROSCOPY; COPPER; COPPER DEPOSITS; DEPOSITION RATES; ELECTRIC CONDUCTIVITY; ELECTROLESS PLATING; MICROSTRUCTURAL EVOLUTION; MICROSTRUCTURE; SCANNING ELECTRON MICROSCOPY; THICKNESS MEASUREMENT;

SUBSTRATES;

EID: 84863562765 PISSN: 00406090 EISSN: None Source Type: Journal
DOI: 10.1016/j.tsf.2012.05.068 Document Type: Article

Times cited : (57)

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