Seedless micropatterning of copper by electroless deposition on self-assembled monolayers

Journal of Materials Chemistry

Volumn , Issue , 2004, Pages 976-981

  Zhu, Peixin ^a   Masuda, Yoshitake ^a   Koumoto, Kunihito ^a  

^a NAGOYA UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CURRENT VOLTAGE CHARACTERISTICS; ELECTROLESS PLATING; METALLIC FILMS; OPTICAL MICROSCOPY; PARTICLE SIZE ANALYSIS; PH EFFECTS; SELF ASSEMBLY; SURFACES;

ELECTROLESS (EL) PATTERNING;

COPPER;

COPPER;

ARTICLE; ATOMIC FORCE MICROSCOPY; CATALYSIS; CHEMICAL COMPOSITION; CHEMICAL STRUCTURE; ELECTRIC POTENTIAL; FILM; MEASUREMENT; MICROSCOPY; PH; REACTION ANALYSIS; STRUCTURE ANALYSIS; TEMPERATURE DEPENDENCE; X RAY DIFFRACTION;

EID: 1842455353     PISSN: 09599428     EISSN: 13645501     Source Type: Journal    
DOI: 10.1039/b311061c     Document Type: Article

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