Thickness dependence of resistivity for Cu films deposited by ion beam deposition

Applied Surface Science

Volumn 217, Issue 1-4, 2003, Pages 95-99

  Lim, J W ^a   Mimura, K ^a   Isshiki, M ^a  

^a TOHOKU UNIVERSITY   (Japan)

Author keywords

Copper; Ion beam; Resistivity; Thickness; Thin films

Indexed keywords

COPPER; DEPOSITION; ELECTRIC CONDUCTIVITY; GRAIN BOUNDARIES; ION BEAMS;

ION BEAM DEPOSITION (IBD);

THIN FILMS;

EID: 0038200844     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0169-4332(03)00522-1     Document Type: Article

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