Glass as a substrate for high density electrical interconnect

10th Electronics Packaging Technology Conference, EPTC 2008

Volumn , Issue , 2008, Pages 12-17

  Cui, Xiaoyun ^a   Bhatt, Deepa ^a   Khoshnaw, Fuad ^a   Hutt, David A ^a   Conway, Paul P ^a  

^a LOUGHBOROUGH UNIVERSITY   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; DEBRIS; DIMENSIONAL STABILITY; ELECTRONIC EQUIPMENT MANUFACTURE; EXCIMER LASERS; GAS LASERS; GLASS; MACHINING; PAPER SHEETING; SUBSTRATES; THERMAL EXPANSION; THERMAL INSULATION;

ALTERNATIVE SUBSTRATES; DIMENSIONAL INSTABILITIES; ELECTRICAL INSULATIONS; ELECTRICAL INTERCONNECT; ELECTROLESS COPPERS; EXCIMER LASER MACHINING; GLASS SHEETS; GLASS SURFACES; HIGH DENSITIES; HIGH-DENSITY INTERCONNECTIONS; HIGH-VOLUME PRODUCTIONS; INTERMEDIATE LAYERS; LASER MACHINING; MANUFACTURING PROCESS; MICROVIAS; MULTILAYER SUBSTRATES; OPTICAL TRANSPARENCIES; ORGANIC SUBSTRATES; PHOTORESIST LAYERS; THIN GLASS SHEETS;

GLASS BONDING;

EID: 63049119391     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2008.4763405     Document Type: Conference Paper

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