Thin glass based packaging technologies for optoelectronic modules

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2009, Pages 207-212

  Brusberg, L ^a   Schroder H ^a   Topper M ^a   Arndt Staufenbiel, N ^a   Roder J ^a   Lutz, M ^a   Reichl, H ^a  

^a FRAUNHOFER IZM   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

COEFFICIENT OF THERMAL EXPANSION; DIELECTRICITY; ELECTRICAL WIRING; FLUIDIC CHANNELS; GLASS SUBSTRATES; GLASS WAFER; HIGH THERMAL; INTEGRATION DENSITY; LASER DIODES; LASER TECHNOLOGIES; LIGHTWAVE CIRCUITS; OPTICAL CHIPS; OPTICAL TRANSPARENCY; PACKAGING TECHNOLOGIES; POLYMER BASED; SENSOR APPLICATIONS; SILICON DIE; SILICON-BASED; STACKED DIE; SUBSTRATE LAYERS; SUBSTRATE MATERIAL; SYSTEM-IN-PACKAGE; THIN GLASS; THROUGH-VIAS; WAVELENGTH RANGES; WIRE BONDING;

CELLULAR RADIO SYSTEMS; CHIP SCALE PACKAGES; DIES; GLASS BONDING; INTEGRATED OPTOELECTRONICS; INTERNET PROTOCOLS; SEMICONDUCTING SILICON COMPOUNDS; SILICON WAFERS; SUBSTRATES; TECHNOLOGY; THERMAL EXPANSION; THERMOANALYSIS; THREE DIMENSIONAL;

PHOTOSENSITIVE GLASS;

EID: 70349677385     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2009.5074018     Document Type: Conference Paper

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