A microbridge method in tensile testing of substrate for fracture toughness of thin films

Nanoscience and Nanotechnology Letters

Volumn 3, Issue 6, 2011, Pages 735-743

  Zhang, Xiaomin ^a   Zhang, Sam ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

Fracture toughness; Microtensile test; Thin films

Indexed keywords

BULK MATERIALS; EDGE CRACKS; FRACTURE STRAIN; FREE-STANDING THIN FILMS; LOADING SYSTEM; MICRO TENSILE TESTS; MICRO-BRIDGE; MICROBRIDGES; TENSILE FORCES; TENSILE LOADING;

CRACKS; FRACTURE; FRACTURE TOUGHNESS; LOADING; MATERIALS TESTING APPARATUS; SILICON WAFERS; TENSILE TESTING; THIN FILMS;

SUBSTRATES;

EID: 84863116691     PISSN: 19414900     EISSN: 19414919     Source Type: Journal    
DOI: 10.1166/nnl.2011.1271     Document Type: Conference Paper

References (40)

1. S. Zhang, D. Sun, Y. Q. Fu, and H. J. Du, Surf. Coat. Technol. 74, 198 (2005).
2. J. M. Jungk, B. L. Boyce, T. E. Buchheit, T. A. Friedmann, D. Yang, and W. W. Gerberich, Acta Mater. 54, 4043 (2006).
3. G. M. Pharr, Materials Sci. Eng. A 253, 151 (1998).
4. B. R. Lawn, and A. G. Evans, J. Am. Ceram. Soc. 63, 574 (1980).
5. J. den Toonder, J. Malzbender, G. de With, and R. Balkenende, J. Mater. Res. 17, 224 (2002).
6. J. Chen and S. J. Bull, Thin Solid Films 494, 1 (2006).
7. M. D. Michel, L. V. Muhlen, C. A. Achete, and C. M. Lepienski, Thin Solid Films 496, 481 (2006).
8. J. Chen and S. J. Bull, Thin Solid Films 517, 2945 (2009).
9. X. Li, D. Diao, and B. Bhushan, Acta Mater. 45, 4453 (1997).
10. J. J. Kruzic and R. O. Ritchie, J. Biomech. 41, 1379 (2008).
11. G. D. Quinn and R. C. Bradt, J. Am. Ceram. Soc. 90, 673 (2007).
12. J. W. Hutchinson and Z. Suo, Adv. Appl. Mech. 29, 63 (1992).
13. B. Merle and M. Göken, Acta Mater. 59, 1772 (2011).
14. Z. H. Xia, W. A. Curtin, and B. W. Sheldon, Acta Mater. 52, 3507 (2004).
15. ASTME-399, American Society for Testing and Materials (1987).
16. H. D. Espinosa and B. C. Prorok, J. Mater. Sci. 38, 4125 (2003).
17. H. Hosokawa, A. V. Desai, and M. A. Haque, Thin Solid Films 516, 6444 (2008).
18. V. Hatty, H. Kahn, J. Trevino, C. A. Zorman, M. Mehregany, R. Ballarini, and A. H. Heuer, J. Appl. Phys. 99, 013517 (2006).
19. I. Chasiotis, S. W. Cho, and K. Jonnalagadda, J. Appl. Mech.- T. ASME 73, 714 (2006).
20. I. Chasiotis and W. G. Knauss, Exp. Mech. 42, 51 (2002).
21. H. D. Espinosa, B. C. Prorok, and M. Fischer, J. Mech. Phys. Solids 51, 47 (2003).
22. H. D. Espinosa, B. C. Prorok, and B. Peng, J. Mech. Phys. Solids 52, 667 (2004).
23. H. Kahn, R. Ballarini, J. J. Bellante, and A. H. Heuer, Science 298, 1215 (2002).
24. J. J. Bellante, H. Kahn, R. Ballarini, C. A. Zorman, M. Mehregany, and A. H. Heuer, Appl. Phys. Lett. 86, 071920 (2005).
25. J. Bäcklund and J. Mackerle, Eng. Fract. Mech. 12, 99 (1979).
26. J. E. Srawley and B. Gross, Eng. Fract. Mech. 4, 587 (1972).
27. J. F. Davalos, P. Madabhusi-Raman, P. Z. Qiao, and M. P. Wolcott, Theor. Appl. Fract. Mec. 29, 125 (1998).
28. C. P. Chen and M. H. Leipold, Am. Ceram. Soc. Bull. 59, 469 (1980).
29. P. Pancheri, P. Bosetti, R. Dal Maschio, and V. M. Sglavo, Eng. Fract. Mech. 59, 447 (1998).
30. A. Hashimoto and D. Kovar, J. Am. Ceram. Soc. 85, 2251 (2002).
31. A. G. Evans, J. Mater. Sci. 7, 1137 (1972).
32. Y. B. Xin and K. J. Hsia, Acta Mater. 44, 845 (1996).
33. V. Bhatt, P. Pal, and S. Chandra, Surf. Coat. Technol. 198, 304 (2005).
34. T. Xu, G. Y. Wu, G. B. Zhang, and Y. L. Hao, Sens. Actuator A-Phys. 104, 61 (2003).
35. C. J. Kim, J. Y. Kim, and B. Sridharan, Sens. Actuator A-Phys. 64, 17 (1998).
36. N. Tas, T. Sonnenberg, H. Jansen, R. Legtenberg, and M. Elwenspoek, J. Mecromech. Microeng. 6, 385 (1996).
37. Murakami (ed.), Stress Intensity Factors Handbook, Oxford, Pergamon (1987).
38. W. A. Brantley, J. Appl. Phys. 44, 534 (1973).
39. A. Chouaf, C. Malhaire, M. Le Berre, M. Dupeux, F. Pourroy, and D. Barbier, Sens. Actuator A-Phys. 84, 109 (2000).
40. G. Janssen, M. M. Abdalla, F. van Keulen, B. R. Pujada, and B. van Venrooy, Thin Solid Films 517, 1858 (2009).