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Volumn 86, Issue 7, 2005, Pages 1-3
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Fracture toughness of polycrystalline silicon carbide thin films
a a a a a a |
Author keywords
[No Author keywords available]
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Indexed keywords
ATMOSPHERIC PRESSURE;
CHEMICAL VAPOR DEPOSITION;
FRACTURE TOUGHNESS;
INDENTATION;
MICROELECTROMECHANICAL DEVICES;
MICROMACHINING;
POLYCRYSTALLINE MATERIALS;
RESIDUAL STRESSES;
SCANNING ELECTRON MICROSCOPY;
SILICON CARBIDE;
STRESS CORROSION CRACKING;
STRESS INTENSITY FACTORS;
TENSILE STRESS;
ATMOSPHERIC PRESSURE CHEMICAL VAPOR DEPOSITION (APCVD);
MICROINDENTATION;
PRECRACK LENGTH;
ROOM TEMPERATURE;
THIN FILMS;
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EID: 17044397795
PISSN: 00036951
EISSN: None
Source Type: Journal
DOI: 10.1063/1.1864246 Document Type: Article |
Times cited : (32)
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References (23)
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