Fracture toughness of low-pressure chemical-vapor-deposited polycrystalline silicon carbide thin films

Journal of Applied Physics

Volumn 99, Issue 1, 2006, Pages

  Hatty, V ^a   Kahn, H ^a   Trevino, J ^a   Zorman, C A ^a   Mehregany, M ^a   Ballarini, R ^a   Heuer, A H ^a  

^a Case Western Reserve University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

LPCVD; MICROMACHINED DEVICE; MICROTENSILE SPECIMEN;

CHEMICAL VAPOR DEPOSITION; FRACTURE TOUGHNESS; MICROMACHINING; POLYCRYSTALLINE MATERIALS; POLYSILICON; SILICON CARBIDE;

THIN FILMS;

EID: 30944460720     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2158135     Document Type: Article

References (15)

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