SCOPUS 정보 검색 플랫폼 - 논문 보기

메뉴 건너뛰기

Scripta Materialia

Volumn 66, Issue 9, 2012, Pages 694-697

Thermomigration of Ti in flip-chip solder joints

(6) Chen, Hsiao Yun a Lin, Han Wen a Liu, Chien Min a Chang, Yuan Wei a Huang, Annie T b Chen, Chih a

a NATIONAL CHIAO TUNG UNIVERSITY (Taiwan)

b RESEARCH CENTER FOR APPLIED SCIENCES (Taiwan)

Author keywords

Diffusion; Intermetallic compounds; Soldering; Titanium

Indexed keywords

CURRENT FLOWS; FLIP CHIP; HEAT OF TRANSPORT; SN-AG SOLDER; SOLDER BUMP; SOLDER JOINTS; THERMOMIGRATION; VOID FORMATION;

ALUMINUM; DIFFUSION; INTERMETALLICS; SOLDERING ALLOYS; TITANIUM;

SOLDERING;

EID: 84862829206 PISSN: 13596462 EISSN: None Source Type: Journal
DOI: 10.1016/j.scriptamat.2012.01.020 Document Type: Article

Times cited : (11)

References (22)

1
- 0242721171
- W.J. Choi, E.C.C. Yeh, and K.N. Tu J. Appl. Phys. 94 2003 5665
- (2003) J. Appl. Phys. , vol.94 , pp. 5665
- Choi, W.J.¹ Yeh, E.C.C.² Tu, K.N.³

2
- 77957003623
- C. Chen, H.M. Tong, and K.N. Tu Annu. Rev. Mater. Res. 40 2010 531
- (2010) Annu. Rev. Mater. Res. , vol.40 , pp. 531
- Chen, C.¹ Tong, H.M.² Tu, K.N.³

3
- 29844448941
- M.O. Alam, B.Y. Wu, Y.C. Chan, and K.N. Tu Acta Mater. 54 2006 613
- (2006) Acta Mater. , vol.54 , pp. 613
- Alam, M.O.¹ Wu, B.Y.² Chan, Y.C.³ Tu, K.N.⁴

4
- 79958223410
- E.C.C. Yeh, W.J. Choi, K.N. Tu, P. Elenius, and H. Balkan Appl. Phys. Lett. 80 2002 580
- (2002) Appl. Phys. Lett. , vol.80 , pp. 580
- Yeh, E.C.C.¹ Choi, W.J.² Tu, K.N.³ Elenius, P.⁴ Balkan, H.⁵

5
- 77349122538
- Y.C. Chan, and D. Yang Prog. Mater. Sci. 55 2010 428
- (2010) Prog. Mater. Sci. , vol.55 , pp. 428
- Chan, Y.C.¹ Yang, D.²

6
- 0037450236
- H. Ye, C. Basaran, and D. Hopkins Appl. Phys. Lett. 82 2003 1045
- (2003) Appl. Phys. Lett. , vol.82 , pp. 1045
- Ye, H.¹ Basaran, C.² Hopkins, D.³

7
- 30744460875
- S.H. Chiu, T.L. Shao, and C. Chen Appl. Phys. Lett. 88 2006 022110
- (2006) Appl. Phys. Lett. , vol.88 , pp. 022110
- Chiu, S.H.¹ Shao, T.L.² Chen, C.³

8
- 33646681929
- A.T. Huang, A.M. Gusak, K.N. Tu, and Y.-S. Lai Appl. Phys. Lett. 88 2006 141911
- (2006) Appl. Phys. Lett. , vol.88 , pp. 141911
- Huang, A.T.¹ Gusak, A.M.² Tu, K.N.³ Lai, Y.-S.⁴

9
- 34247241706
- H.Y. Hsiao, and C. Chen Appl. Phys. Lett. 90 2007 152105
- (2007) Appl. Phys. Lett. , vol.90 , pp. 152105
- Hsiao, H.Y.¹ Chen, C.²

10
- 79751533166
- X. Gu, K.C. Yung, Y.C. Chan, and D. Yang J. Mater. Sci. Mater. Electron. 22 2011 217
- (2011) J. Mater. Sci. Mater. Electron. , vol.22 , pp. 217
- Gu, X.¹ Yung, K.C.² Chan, Y.C.³ Yang, D.⁴

11
- 49749118348
- H.Y. Hsiao, S.W. Liang, M.F. Ku, C. Chen, and D.J. Yao J. Appl. Phys. 104 2008 033708
- (2008) J. Appl. Phys. , vol.104 , pp. 033708
- Hsiao, H.Y.¹ Liang, S.W.² Ku, M.F.³ Chen, C.⁴ Yao, D.J.⁵

12
- 62149085090
- H.Y. Hsiao, and C. Chen Appl. Phys. Lett. 94 2009 092107
- (2009) Appl. Phys. Lett. , vol.94 , pp. 092107
- Hsiao, H.Y.¹ Chen, C.²

13
- 52949145973
- H.Y. Chen, C. Chen, and K.N. Tu Appl. Phys. Lett. 93 2008 122103
- (2008) Appl. Phys. Lett. , vol.93 , pp. 122103
- Chen, H.Y.¹ Chen, C.² Tu, K.N.³

14
- 79959381371
- H.Y. Chen, and C. Chen J. Mater. Res. 26 2011 983
- (2011) J. Mater. Res. , vol.26 , pp. 983
- Chen, H.Y.¹ Chen, C.²

15
- 0004013464
- Elsevier Amsterdam Chap. 7
- R.W. Cahn, and P. Haasen Physical Metallurgy 1983 Elsevier Amsterdam Chap. 7
- (1983) Physical Metallurgy
- Cahn, R.W.¹ Haasen, P.²

16
- 28444440297
- F.W. Wulff, C.D. Breach, D. Stephan, Saraswati, K.J. Dittmer, in: Proceedings of the sixth Electronics Packaging Technology Conference, EPTC 2004, pp. 348-353.
- Proceedings of the Sixth Electronics Packaging Technology Conference, EPTC 2004 , pp. 348-353
- Wulff, F.W.¹ Breach, C.D.² Stephan, D.³ Saraswati⁴ Dittmer, K.J.⁵

17
- 34848822771
- Y.W. Chang, T.H. Chiang, and C. Chen Appl. Phys. Lett. 91 2007 132113
- (2007) Appl. Phys. Lett. , vol.91 , pp. 132113
- Chang, Y.W.¹ Chiang, T.H.² Chen, C.³

18
- 0004255385
- second ed. TMS Warrendale, PA
- P.G. Shewmon Diffusion in Solids second ed. 1989 TMS Warrendale, PA
- (1989) Diffusion in Solids
- Shewmon, P.G.¹

19
- 0003713517
- ASM International Materials Park, OH
- H. Baker ASM Handbook, Vol. 3, Alloy Phase Diagrams 1992 ASM International Materials Park, OH
- (1992) ASM Handbook, Vol. 3, Alloy Phase Diagrams
- Baker, H.¹

20
- 0020878227
- H.T.G. Hentzell, R.D. Thompson, and K.N. Tu J. Appl. Phys. 54 1983 6923
- (1983) J. Appl. Phys. , vol.54 , pp. 6923
- Hentzell, H.T.G.¹ Thompson, R.D.² Tu, K.N.³

21
- 0004223936
- Wiley New York, Chap. 8
- D.V. Ragone Thermodynamics of Materials 1995 Wiley New York Vol. 2, Chap. 8
- (1995) Thermodynamics of Materials , vol.2
- Ragone, D.V.¹

22
- 49649157846
- J.H. Matlock, and J.P. Stark Acta Mater. 19 1971 923
- (1971) Acta Mater. , vol.19 , pp. 923
- Matlock, J.H.¹ Stark, J.P.²

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.