Characterisation of intermetallic growth in copper and gold ball bonds on aluminium metallisation

Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004

Volumn , Issue , 2004, Pages 348-353

  Wulff, F W ^a   Breach, C D ^a   Stephan Saraswati, D ^a   Dittmer, K J ^a  

^a Kulicke and Soffa SEA Pte Ltd   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; INTERMETALLICS; ISOTHERMS; METALLIZING; OPTIMIZATION;

GOLD BALL BONDS; INTERMETALLIC PHASE (IP);

COPPER;

EID: 28444440297     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (18)

1. Tomlinson, W. J., Winkle, R. V. and Blackmore, L. A. "Effect of heat treatment on the shear strength and fracture modes of copper wire thermosonic ball bonds to A1-1% Si device metallisation". IEEE Trans. Comp. Hybr. & Packkg. Techn. 13(3) 1990 587.
2. Toyozawa, K., Fujita, K., Minamide, S. and Maeda, T. "Development of copper wire bonding application technology". IEEE Trans. Comp. Hybr. & Packkg. Techn. 13(4) 1990 667.
3. Nguyen, L.T., McDinald, D. and Anselm, A. R. "Optimisation of copper wire bonding on Al-Cu metallisaation". IEEE Trans. Comp. Packg. Manfg. Techm. 18(2) 1995423.
4. Bischof, A and Aldinger F. "Ball bonding of non-precious metals". Semiconductor Int. Aug 1986 p 126.
5. Kim, H. J., Lee, J. Y., Paik, K. W., Koh, K. W., Won, J., Choe, S., Lee, J., Moon, J. T. and Park, Y. J. "Effects of intermetallic compound (IMC) on copper wire and aluminum pad bondability". IEEE Trans. Comp. Packg. Manfg. Techm. 26(2) 2003 367.
6. Murali, S., Srikanth, N. and Vath, C. J. "An analysis of intermetallics formation of gold and copper ballbonding on thermal ageing". Mater. Res. Bull.38 2003 637.
7. Tan, C. W., Daud, A. R. and Yarmo, M. A. "Corrosion study at Cu-Al interface in microelectronics packaging". Appl. Surf. Sci. 191 2002 67.
8. Global Semiconductor Packaging Materials Outlook; Semiconductor Equipment and Materials International and TechSearch International, Inc.; February 2004.
9. 4Al". Microelectronics Reliability 2004 44: 973.
10. Dittmer K, Kumar S, Wulff F. Intermetallic growth in small ball bonds. Proc. SEMICON Singapore, Test, Assembly and Packaging, May, 1998: 267-272.
11. th Singapore (2004).
12. Wulff, F and Breach, C. D. In preparation.
13. Wulff F. and Ahrens T. "Microstructure and materials analysis for electronics packaging". Struers Journal of Materialography 1998; 32: 9.
14. Vovk V, Schmitz G, Kirchheim. "Nucleation of product phase in reactive diffusion of Al/Co". Physical Review B 2004; 69: 104102.
15. Vandenberg, J.M.; Hamm, R.A.: Thin Solid Films 97 (1982) p 313ff.
16. Pretorius R, Marais TK, Theron CC. "Thin film compound phase formation sequence: an effective heat of formation model". Materials Science and Engineering Reports 1993; 10: 1.
17. Bischoff, A.; Aldinger, F: Proc. 34 Electrn. Comp. Conf., New Orleans, 1984, p 411 ff.
18. Cheung TA, Xu Y. Gases evolved during cure and solder reflow of encapsulants and underfills. Proceedings of EPTC 2001.