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Journal of Alloys and Compounds

Volumn 499, Issue 2, 2010, Pages 149-153

Effect of Cu concentration, solder volume, and temperature on the reaction between SnAgCu solders and Ni

(4) Yang, S C a Chang, C C a Tsai, M H a Kao, C R a

a NATIONAL TAIWAN UNIVERSITY (Taiwan)

Author keywords

Diffusion; Intermetallics; Soldering

Indexed keywords

AGING TEMPERATURES; DIFFERENT SIZES; INTERFACIAL REACTIONS; INTERMETALLIC COMPOUNDS; LIQUID-SOLID REACTION; SNAGCU SOLDER; SOLDER VOLUME; SOLID-SOLID REACTION; TEMPERATURE DECREASE;

CONCENTRATION (PROCESS); INTERMETALLICS; SOLDERING ALLOYS; TIN;

SOLDERING;

EID: 77953131590 PISSN: 09258388 EISSN: None Source Type: Journal
DOI: 10.1016/j.jallcom.2010.03.168 Document Type: Article

Times cited : (54)

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