Analytical prediction of crosstalk among vias in multilayer printed circuit boards

IEEE Transactions on Electromagnetic Compatibility

Volumn 54, Issue 2, 2012, Pages 413-420

  Wu, Songping ^a   Fan, Jun ^b  

^a CISCO SYSTEMS   (United States)

^b MISSOURI UNIVERSITY OF SCIENCE AND TECHNOLOGY   (United States)

Author keywords

Physics based via circuit model; printed circuit board (PCB); signal integrity; via crosstalk; via models

Indexed keywords

ANALYTICAL PREDICTIONS; CIRCUIT DENSITY; CIRCUIT MODELS; CRITICAL NET; CROSS-TALK ESTIMATION; HIGH-SPEED; MULTILAYER PRINTED CIRCUIT BOARD; PCB DESIGN; SIGNAL INTEGRITY; SIGNAL QUALITY;

CROSSTALK; FORECASTING; MULTILAYERS;

PRINTED CIRCUIT BOARDS;

EID: 84862822399     PISSN: 00189375     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEMC.2011.2179658     Document Type: Article

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