Investigation of crosstalk among vias

IEEE International Symposium on Electromagnetic Compatibility

Volumn , Issue , 2009, Pages 186-190

  Wu, Songping ^a   Fan, Jun ^a  

^a MISSOURI UNIVERSITY OF SCIENCE AND TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CIRCUIT DENSITY; CRITICAL PROBLEMS; DESIGN VERIFICATION; EQUIVALENT CIRCUIT MODEL; GEOMETRICAL PARAMETERS; HIGH SPEED DIGITAL CIRCUIT; MULTI-STEP; PARALLEL PLANES; PHYSICS-BASED; SIGNAL QUALITY; UNDERLYING MECHANISM;

CROSSTALK; DIGITAL INTEGRATED CIRCUITS; ELECTROMAGNETIC COMPATIBILITY; JITTER; PLASTIC MOLDS; PRINTED CIRCUIT MANUFACTURE;

PRINTED CIRCUIT BOARDS;

EID: 74349106923     PISSN: 10774076     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISEMC.2009.5284637     Document Type: Conference Paper

References (8)

1. X. Chang, B. Archambeault, M. Cocchini, F. De Paulis, V. Sivarajan, et al "Return via connections for extending signal link path bandwidth of via transitions", IEEE EMC Europe, Hamburg Germany, September, 2008.
2. C. Schuster, Y. Kwark, G. Selli, and P. Muthana, "Developing a 'physical' model for vias," DesignCon 2006, Santa Clara, CA. February, 2006
3. E. Bogatin, Signal Integrity: Simplified, New Jersy: Prentice Hall, 2003, pp. 404-405.
4. M. Cocchini, W. Cheng, J. Zhang, J. Fisher, J Fan, J Drewniak and Y. Zhang, "Differential vias transition modeling in a multilayer printed circuit board," IEEE International Symposium 2006, Detroit, MI. August 2008
5. S. Wu, X. Chang and J. Fan, "Eliminating via-plane coupling using ground vias for high-speed signal transition," EPEP 2008, Saint Jose, CA, 2008, pp. 247-250.
6. G. Selli, C. Schuster, Y. H. Kwark, M. B. Ritter, and J. L. Drewniak, "Developing a physical model for vias - part II: coupled and grounded return vias," DesignCon 2007, Santa Clara, 2007
7. Y. Zhang, J. Fan, G. Selli, M. Cocchini, and F. Paulis, "Analytical evaluation of via-plate capacitance for multilayer printed circuit boards and packages", IEEE Transactions on Microwave Theory and Techniques, Vol.56, No.9, September, 2008, pp2118-2128
8. A.R.Chada, Y. Zhang, G. Feng, J. L. Drewniak, and J., Fan, "Impedance of an infinitely large parallel-plane pair and its applications in engineering modeling," submitted to the IEEE International Symposium on Electromagnetic Compatibility, Austin, TX, 2009