메뉴 건너뛰기




Volumn 58, Issue 12 PART 1, 2010, Pages 3780-3789

A novel impedance definition of a parallel plate pair for an intrinsic via circuit model

Author keywords

Boundary integral equation method; impedance of a parallel plate pair; radial scattering parameters; radial transmission line ports; transforms between radial scattering and impedance parameters

Indexed keywords

ADDITION THEOREM; ANALYTICAL FORMULAS; BOUNDARY INTEGRAL EQUATION METHOD; CIRCUIT MODELS; CIRCULAR PLATES; CYLINDRICAL WAVE; IMPEDANCE MATRICES; NUMERICAL SIMULATION; PAIR INTERACTIONS; PARALLEL PLATES; PERFECT MAGNETIC CONDUCTORS; RADIAL PORTS; RADIAL SCATTERING; RADIAL TRANSMISSION-LINE PORTS; RIGOROUS ANALYSIS; SOLID PLATES; TRANSMISSION LINE; ZERO-ORDER MODE;

EID: 78650261066     PISSN: 00189480     EISSN: None     Source Type: Journal    
DOI: 10.1109/TMTT.2010.2083870     Document Type: Conference Paper
Times cited : (55)

References (21)
  • 1
    • 77955713938 scopus 로고    scopus 로고
    • An intrinsic circuit model for multiple vias in an irregular plate pair through rigorous electromagnetic analysis
    • Aug.
    • Y.-J. Zhang and J. Fan, "An intrinsic circuit model for multiple vias in an irregular plate pair through rigorous electromagnetic analysis," IEEE Trans. Microw. Theory Tech., vol. 58, no. 8, pp. 2251-2265, Aug. 2010.
    • (2010) IEEE Trans. Microw. Theory Tech. , vol.58 , Issue.8 , pp. 2251-2265
    • Zhang, Y.-J.1    Fan, J.2
  • 3
    • 44949245120 scopus 로고    scopus 로고
    • Impedance expressions for unloaded and loaded power ground planes
    • May
    • J. Trinkle and A. Cantoni, "Impedance expressions for unloaded and loaded power ground planes," IEEE Trans. Electromagn. Compat., vol. 50, no. 2, pp. 390-398, May 2008.
    • (2008) IEEE Trans. Electromagn. Compat. , vol.50 , Issue.2 , pp. 390-398
    • Trinkle, J.1    Cantoni, A.2
  • 4
    • 0018442043 scopus 로고
    • Theory and experiment on microstrip antennas
    • Mar.
    • Y. T. Lo, D. Solomon, and W. F. Richards, "Theory and experiment on microstrip antennas," IEEE Trans. Antennas Propagat., vol. AP-27, no. 2, pp. 137-145, Mar. 1979.
    • (1979) IEEE Trans. Antennas Propagat. , vol.AP-27 , Issue.2 , pp. 137-145
    • Lo, Y.T.1    Solomon, D.2    Richards, W.F.3
  • 5
    • 15044344898 scopus 로고    scopus 로고
    • Convergence acceleration and accuracy improvement in power bus impedance calculation with a fast algorithm using cavity modes
    • Feb.
    • Z. L. Wang, O. Wada, Y. Toyota, and R. Koga, "Convergence acceleration and accuracy improvement in power bus impedance calculation with a fast algorithm using cavity modes," IEEE Trans. Electromag. Compat., vol. 47, no. 1, pp. 2-9, Feb. 2005.
    • (2005) IEEE Trans. Electromag. Compat. , vol.47 , Issue.1 , pp. 2-9
    • Wang, Z.L.1    Wada, O.2    Toyota, Y.3    Koga, R.4
  • 6
    • 31744444909 scopus 로고    scopus 로고
    • An efficient method for calculating bounces in the irregular power/ground plane structure with holes inhigh-speed PCBs
    • P. Liu and Z.-F. Li, "An efficient method for calculating bounces in the irregular power/ground plane structure with holes inhigh-speed PCBs," IEEE Trans. Electromagn. Compat., vol. 47, pp. 889-898, 2005.
    • (2005) IEEE Trans. Electromagn. Compat. , vol.47 , pp. 889-898
    • Liu, P.1    Li, Z.-F.2
  • 7
    • 33645818961 scopus 로고    scopus 로고
    • Hybrid analytical modeling method for split power bus in multilayered package
    • Feb.
    • Y. Joeong, A. C. Lu, L. L. Wai, W. Fan, B. K. Lok, H. Park, and J. Kim, "Hybrid analytical modeling method for split power bus in multilayered package," IEEE Trans. Electromagn. Compat., vol. 48, no. 1, pp. 82-94, Feb. 2006.
    • (2006) IEEE Trans. Electromagn. Compat. , vol.48 , Issue.1 , pp. 82-94
    • Joeong, Y.1    Lu, A.C.2    Wai, L.L.3    Fan, W.4    Lok, B.K.5    Park, H.6    Kim, J.7
  • 8
    • 33646507463 scopus 로고    scopus 로고
    • An efficient approach for power delivery network design with closed-form expressions for parasitic interconnect inductances
    • May
    • C. Wang, J. Mao, G. Selli,S. Luan,L. Zhang, J. Fan,D. J. Pommerenke, R. E. DuBroff, and J. L. Drewniak, "An efficient approach for power delivery network design with closed-form expressions for parasitic interconnect inductances," IEEE Trans. Adv. Packag., vol. 29, no. 2, pp. 320-334, May 2006.
    • (2006) IEEE Trans. Adv. Packag. , vol.29 , Issue.2 , pp. 320-334
    • Wang, C.1    Mao, J.2    Selli, G.3    Luan, S.4    Zhang, L.5    Fan, J.6    Pommerenke, D.J.7    DuBroff, R.E.8    Drewniak, J.L.9
  • 9
    • 44449148385 scopus 로고    scopus 로고
    • Delaunay-Voronoi modeling of power-ground planes with source correction
    • May
    • K.-B. Wu, G.-H. Shiue, W.-D. Guo, C.-M. Lin, and R.-B. Wu, "Delaunay-Voronoi modeling of power-ground planes with source correction," IEEE Trans. Adv. Packag., vol. 31, no. 2, pp. 303-310, May 2008.
    • (2008) IEEE Trans. Adv. Packag. , vol.31 , Issue.2 , pp. 303-310
    • Wu, K.-B.1    Shiue, G.-H.2    Guo, W.-D.3    Lin, C.-M.4    Wu, R.-B.5
  • 10
    • 36348967803 scopus 로고    scopus 로고
    • Modeling noise coupling between package and PCB power/ ground planes with an efficient 2-D FDTD/lumped element method
    • Nov.
    • T.-K. Wang, S.-T. Chen, C.-W. Tsai, S.-M. Wu, J. L. Drewniak, and T.-L. Wu, "Modeling noise coupling between package and PCB power/ ground planes with an efficient 2-D FDTD/lumped element method," IEEE Trans. Adv. Packag., vol. 30, no. 4, pp. 864-871, Nov. 2007.
    • (2007) IEEE Trans. Adv. Packag. , vol.30 , Issue.4 , pp. 864-871
    • Wang, T.-K.1    Chen, S.-T.2    Tsai, C.-W.3    Wu, S.-M.4    Drewniak, J.L.5    Wu, T.-L.6
  • 11
    • 34347396973 scopus 로고    scopus 로고
    • Multilayered finite - Difference method (MFDM) for modeling of package and printed circuit board planes
    • May
    • A. E. Engin, K. Bharath, and M. Swaminathan, "Multilayered finite - Difference method (MFDM) for modeling of package and printed circuit board planes," IEEE Trans. Electromagn. Compat., vol. 49, no. 2, pp. 441-447, May 2007.
    • (2007) IEEE Trans. Electromagn. Compat. , vol.49 , Issue.2 , pp. 441-447
    • Engin, A.E.1    Bharath, K.2    Swaminathan, M.3
  • 12
    • 33747625200 scopus 로고    scopus 로고
    • Circuit models for power bus structures on printed circuit boards using a hybrid FEM-SPICE method
    • Aug.
    • C. Guo and T. H. Hubing, "Circuit models for power bus structures on printed circuit boards using a hybrid FEM-SPICE method," IEEE Trans. Adv. Packag., vol. 29, no. 3, pp. 441-447, Aug. 2006.
    • (2006) IEEE Trans. Adv. Packag. , vol.29 , Issue.3 , pp. 441-447
    • Guo, C.1    Hubing, T.H.2
  • 13
    • 0036706369 scopus 로고    scopus 로고
    • New efficient method of modeling electronics packages with layered power/ground planes
    • Aug.
    • W. Shi and J. Fang, "New efficient method of modeling electronics packages with layered power/ground planes," IEEE Trans. Adv. Packag., vol. 25, no. 3, pp. 417-423, Aug. 2002.
    • (2002) IEEE Trans. Adv. Packag. , vol.25 , Issue.3 , pp. 417-423
    • Shi, W.1    Fang, J.2
  • 14
    • 0041861380 scopus 로고    scopus 로고
    • The development of a closed-form expression for the input imedance of power-return plane structures
    • M. Xu and T. H. Hubing, "The development of a closed-form expression for the input imedance of power-return plane structures," IEEE Trans. Electromagn. Compat., vol. 45, pp. 478-485, 2003.
    • (2003) IEEE Trans. Electromagn. Compat. , vol.45 , pp. 478-485
    • Xu, M.1    Hubing, T.H.2
  • 15
    • 84866404184 scopus 로고    scopus 로고
    • Developing a 'physical' model for vias
    • Santa Clara, CA, Feb. 6-9
    • C. Schuster, Y. Kwark, G. Selli, and P. Muthana, "Developing a 'physical' model for vias," in Proc. DesignCon, Santa Clara, CA, Feb. 6-9, 2006.
    • (2006) Proc. DesignCon
    • Schuster, C.1    Kwark, Y.2    Selli, G.3    Muthana, P.4
  • 16
    • 84866362819 scopus 로고    scopus 로고
    • Developing a physical via model for vias - Part II: Coupled and ground return vias
    • Santa Clara, CA, Jan. 29-Feb. 1
    • G. Selli, C. Schuster, Y. H. Kwark, M. B. Ritter, and J. L. Drewniak, "Developing a physical via model for vias - Part II: Coupled and ground return vias," in Proc. DesignCon, Santa Clara, CA, Jan. 29-Feb. 1 2007.
    • (2007) Proc. DesignCon
    • Selli, G.1    Schuster, C.2    Kwark, Y.H.3    Ritter, M.B.4    Drewniak, J.L.5
  • 20
    • 54049098239 scopus 로고    scopus 로고
    • Efficient simulation of power distribution network by using integral-equation and modeldecoupling technology
    • X. C. Wei, E. P. Li, E. X. Liu, and R. Vahldieck, "Efficient simulation of power distribution network by using integral-equation and modeldecoupling technology," IEEE Trans. Microw. Theory Tech., vol. 56, no. 10, pp. 2277-2285, 2008.
    • (2008) IEEE Trans. Microw. Theory Tech. , vol.56 , Issue.10 , pp. 2277-2285
    • Wei, X.C.1    Li, E.P.2    Liu, E.X.3    Vahldieck, R.4
  • 21
    • 0034290010 scopus 로고    scopus 로고
    • Integral equation solution of Maxwell's equations from zero frequencyto microwave frequencies
    • J.-S. Zhao and W. C. Chew, "Integral equation solution of Maxwell's equations from zero frequencyto microwave frequencies," IEEE Trans. Antennas Propagat., vol. 48, no. 10, pp. 1635-1645, 2000.
    • (2000) IEEE Trans. Antennas Propagat. , vol.48 , Issue.10 , pp. 1635-1645
    • Zhao, J.-S.1    Chew, W.C.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.