Differential vias transition modeling in a multilayer printed circuit board

IEEE International Symposium on Electromagnetic Compatibility

Volumn 2008-January, Issue , 2008, Pages

  Cocchini, Matteo ^a   Wheling Cheng, ^b   Jianmin Zhang, ^b   Fisher, John ^b   Fan, Jun ^a   Drewniak, James L ^a   Yaojiang Zhang, ^a  

^a MISSOURI UNIVERSITY OF SCIENCE AND TECHNOLOGY   (United States)

^b CISCO SYSTEMS   (United States)

Author keywords

cavity model; Differential signal; ground vias; noise coupling; signal via transition; via capacitance

Indexed keywords

ELECTROMAGNETIC COMPATIBILITY; SCATTERING PARAMETERS; SPICE; STRIP TELECOMMUNICATION LINES; TIMING CIRCUITS;

CAVITY MODEL; DIFFERENTIAL MEASUREMENTS; DIFFERENTIAL SIGNAL; FABRICATION TOLERANCES; GROUND VIAS; MULTILAYER PRINTED CIRCUIT BOARD; NOISE COUPLING; PHYSICS-BASED CIRCUIT MODELS;

PRINTED CIRCUIT BOARDS;

EID: 79851477222     PISSN: 10774076     EISSN: 21581118     Source Type: Conference Proceeding    
DOI: 10.1109/ISEMC.2008.4652164     Document Type: Conference Paper

References (5)

1. C. Schuster, Y. Kwark, G. Selli, and P. Muthana, "Developing a physical model for vias, " DesignCon 2006, February 6-9, 2006, Santa Clara, CA.
2. G. Selli, C. Schuster, Y. H. Kwark, M. B. Ritter, and J. L. Drewniak, "Developing a physical model for vias-part II: coupled and grounded return vias, " Designcon 2007, Santa Clara, 2007.
3. T. Okoshi, Y. Uehara, and T. Takeuchi, "The segmentation method-An approach to the analysis of microwave planar circuits, " IEEE Transactions on Microwave Theory and Techniques, vol. MTT-24, no. 10, pp. 662-668, Oct. 1976
4. J. Knighten, J., B. Archambeault, J. Fan, G. Selli, L. Xue, S. Connor, J. Drewniak, "PDN Design Strategies: III. Planes and Materials-Are they Important Factors in Power Bus Design?, " IEEE EMC Society Newsletter, Issue No. . 208, Winter 2006, pp. 56-67.
5. F. de Paulis, J. Diepenbrock, B. Archambeault, S. Connor, J. Fan, J. Drewniak, "Link path analysis on a block-by-block basis", submitted at IEEE International Symposium on Electromagnetic Compatibility-August 18-22, 2008, Detroit USA