Power electronics cooling effectiveness versus thermal inertia

IEEE Transactions on Power Electronics

Volumn 20, Issue 3, 2005, Pages 687-693

  Meysenc, Luc ^a   Jylhäkallio, Mervi ^a   Barbosa, Peter ^a  

^a ABB SWITZERLAND LTD   (Switzerland)

Author keywords

Liquid cooled plate; Load variation frequencies; Power electronics integration; Silicon; Thermal inertia

Indexed keywords

COOLING; ELECTRONICS INDUSTRY; HEAT RESISTANCE; INTEGRATED CIRCUIT LAYOUT; POWER INTEGRATED CIRCUITS; SEMICONDUCTING SILICON; THERMAL CYCLING; THERMAL EFFECTS;

COOLING EFFECTIVENESS; LIQUID COOLED PLATE; LOAD VARIATION FREQUENCIES; POWER ELECTRONICS COOLING; POWER ELECTRONICS INTEGRATION; THERMAL INTERTIA;

POWER ELECTRONICS;

EID: 19144363513     PISSN: 08858993     EISSN: None     Source Type: Journal    
DOI: 10.1109/TPEL.2005.846548     Document Type: Article

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