Reducing thermal contact resistance using a bilayer aligned CNT thermal interface material

Chemical Engineering Science

Volumn 65, Issue 3, 2010, Pages 1101-1108

  Wang, H ^a   Feng, J Y ^b   Hu, X J ^a   Ng, K M ^a,b  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

^b Nano and Advanced Materials Institute Limited   (Hong Kong)

Author keywords

Bilays carbon nanotubes; Heat conduction; Heat transfer; Thermal contact resistance; Thermal interface materials; Thermal management

Indexed keywords

A-THERMAL; ALIGNED CARBON NANOTUBES; BI-LAYER; BILAYS CARBON NANOTUBES; CONDUCTIVE ELASTOMERS; CONTACT PRESSURES; COPPER FOILS; COPPER PLATE; DIRECT CONTACT; FILLING IN; HEAT SOURCES; LASER FLASH METHODS; OVERALL THERMAL RESISTANCE; SPACE BETWEEN; THERMAL CONTACT RESISTANCE; THERMAL INTERFACE MATERIALS; THERMAL MANAGEMENT; THERMAL RESISTANCE; THIN COPPER FOILS;

CARBON NANOTUBES; CONDUCTING POLYMERS; CONTACT RESISTANCE; COPPER; ELECTRONIC EQUIPMENT; FATIGUE OF MATERIALS; HEAT CONDUCTION; HEAT EXCHANGERS; TECHNOLOGICAL FORECASTING; TEMPERATURE CONTROL; THERMAL CONDUCTIVITY; THERMAL CONDUCTIVITY OF SOLIDS; THERMAL INSULATING MATERIALS; THERMOANALYSIS;

HEAT RESISTANCE;

EID: 71549153228     PISSN: 00092509     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ces.2009.09.064     Document Type: Article

References (28)

1. Antonetti V.W., Whittle T.D., and Simons R.E. An approximate thermal contact conductance correlation. Exp/Numer. Heat Transfer Combus. Phase Change (1991) 35-42
2. Antonetti, V.W., Yovanovich, M.M., 1984. Thermal contact resistance in microelectronic equipment. In: ISHM Technical Monograph Series 6984-003, pp. 135-151.
3. Cho D.B., Suhr J., and Koratkar N.A. Carbon nanotube thin film coating for improved thermal management in piezoceramic sheet actuators. J. Intell. Mater. Syst. Struct. 17 (2006) 209-216
4. Chu, H.Y., Chang, T.C., Hsu, W.K., Fang, W.L., 2005. Concrete the aligned CNT-films. In: Proceedings of the 13th International Conference on Solid-state Sensors, Actuators and Microsystems, Seoul, Korea, pp. 863-866.
5. Cola B.A., Xu X.F., and Fihser T.S. Increased real contact in thermal interface: a carbon nanotube/foil material. Appl. Phys. Lett. 90 (2007) 093513
6. Dai H.J., Wong E.W., and Lieber C.M. Probing electrical transport in nanomaterials: conductivity of individual carbon nanotubes. Science 272 (1996) 523-526
7. Gustafsson S.E. Transient plane source techniques for thermal conductivity and thermal diffusivity measurements of solid materials. Rev. Sci. Instrum. 62 (1991) 797-804
8. Gwinn J.P., and Webb R.L. Performance and testing of thermal interface materials. Microelectron. J. 34 (2003) 215-222
9. Huang H., Liu C.H., Wu Y., and Fan S.S. Aligned carbon nanotube films for thermal management. Adv. Mater. 17 (2005) 1652-1656
10. Joshua P.S., Li S., and Kim P. Mesoscopic thermal and thermoelectric measurements of individual carbon nanotubes. Solid State Commun. 127 (2003) 181-186
11. Kim P., Shi L., Majumdar A., and McEuen P.L. Thermal transport measurements of individual multiwalled nanotubes. Phys. Rev. Lett. 87 (2001) 215502-215514
12. Leong C.K., Aoyagi Y., and Chung D.D.L. Carbon black pastes as coatings for improving thermal gap-filling materials. Carbon 44 (2006) 435-440
13. Leong C.K., and Chung D.D.L. Carbon black dispersions as thermal pastes that surpass solder in providing high thermal contact conductance. Carbon 41 (2003) 2459-2469
14. Liu C.H., Huang H., Wu Y., and Fan S.S. Thermal conductivity improvement of silicone elastomer with carbon nanotube loading. Appl. Phys. Lett. 84 (2004) 4248-4250
15. Mahajan R., Chiu C.P., and Prasher R. Thermal interface materials: a brief review of design characteristics and materials. Electron. Cooling 10 1 (2004)
16. Rao V.V., Bapurao K., Nagaraju J., and Krishna M.V. Instrumentation to measure thermal contact resistance. Meas. Sci. Technol. 15 (2004) 275-278
17. Savija I., Culham J.R., Yovanovich M.M., and Marotta E.E. Review of thermal conductance models for joints incorporating enhancement materials. J. Thermophys. Heat Transfer 17 (2003) 43-52
18. Shaikh S., Lafdi K., and Silverman E. The effect of a CNT interface on the thermal resistance of contacting surfaces. Carbon 45 (2007) 695-703
19. Treacy M.M., Ebbesen T.W., and Gibson J.M. Exceptionally high Young's modulus observed for individual carbon nanotubes. Nature 381 (1996) 678-680
20. Wang H., Feng J.Y., Hu X.J., and Ng K.M. Synthesis of aligned carbon nanotubes on double-sided metallic substrate by chemical vapor deposition. J. Phys. Chem. C 111 (2007) 12617-12624
21. Wang H., Feng J., Hu X., and Ng K.M. Tribological behaviors of aligned carbon nanotubes-epoxy nanocomposites. Polym. Eng. Sci. 48 (2008) 1467-1475
22. Xu, J., Fisher, T.S., 2004. Enhanced thermal contact conductance using carbon nanotube arrays. In: Proceedings of Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, vol. 34, pp. 549-555.
23. Yovanovich, M.M., 1981. New contact and gap correlations for conforming rough surfaces. In: AIAA 16th Thermophysics Conference, Palo Alto, CA.
24. Yovanovich, M.M., 1991. Theory and applications of constriction and spreading resistance concepts for microelectronic thermal management. In: Cooling Techniques for Computers, Hemisphere Publishing Corporation, pp. 277-332.
25. Yovanovich, M.M., Antonetti, V.W., 1988. Application of thermal contact resistance theory to electronic packages. In: Advances in Thermal Modeling of Electronic Components and Systems, Hemisphere Publishing Corporation, vol. 1, pp. 79-128.
26. Yovanovich, M.M., Culham, J.R., Teertstra, P., 1997. Calculating interface resistance. In: Electronics Cooling, vol. 3.
27. Zhang W.D., Wen Y., Liu S.M., Tjiu W.C., Xu G.Q., and Gan L.M. Synthesis of vertically aligned carbon nanotubes on metal deposited quartz plates. Carbon 40 (2002) 1981-1989
28. Zhang, K., Yuan, M.F., Wang, N., Miao, J.Y., Xiao, G.W., Fan, H.B., 2006. Thermal interface material with aligned CNT and its application in HB-LED packaging. In: Electronic Components and Technology Conference, pp. 177-182.