Carbon black dispersions as thermal pastes that surpass solder in providing high thermal contact conductance

Carbon

Volumn 41, Issue 13, 2003, Pages 2459-2469

  Leong, Chia Ken ^a   Chung, D D L ^a  

^a UNIVERSITY AT BUFFALO   (United States)

Author keywords

A. Carbon black; C. Thermal analysis; D. Thermal conductivity

Indexed keywords

BUTENES; HEAT LOSSES; INTERFACES (MATERIALS); POLYETHYLENE GLYCOLS; SOLDERING; THERMAL CONDUCTIVITY; THERMOANALYSIS;

THERMAL CONTACTS;

CARBON BLACK;

EID: 0141637221     PISSN: 00086223     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0008-6223(03)00247-1     Document Type: Article

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