Thermal interface materials for power electronics applications

2008 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, I-THERM

Volumn , Issue , 2008, Pages 395-404

  Narumanchi, Sreekant ^a   Mihalic, Mark ^a   Kelly, Kenneth ^a   Eesley, Gary ^b  

^a NATIONAL RENEWABLE ENERGY LABORATORY   (United States)

^b One Corporate Center ^*  (United States)

Author keywords

ASTM D5470; Greases; IGBTs; Laser flash; Modeling; PCMs; Steady state; Thermal resistance; Transient

Indexed keywords

ACTIVE FILTERS; AUTOMOBILE ELECTRONIC EQUIPMENT; BIPOLAR TRANSISTORS; COOLING; COOLING WATER; COPPER; DIES; ELECTRONICS ENGINEERING; ETHYLENE GLYCOL; FIGHTER AIRCRAFT; FINITE ELEMENT METHOD; FLUXES; FORMING; GLYCOLS; HEAT FLUX; HEATING EQUIPMENT; INSULATED GATE BIPOLAR TRANSISTORS (IGBT); LUBRICATING GREASES; PHASE CHANGE MATERIALS; POWER ELECTRONICS; SILICON; SILICON CARBIDE; TECHNOLOGICAL FORECASTING; THERMAL INSULATING MATERIALS; THERMOMECHANICAL TREATMENT; THERMONUCLEAR REACTIONS; TRANSISTORS;

ASTM D5470; GREASES; IGBTS; LASER FLASH; MODELING; PCMS; STEADY STATE; THERMAL RESISTANCE; TRANSIENT;

PHASE INTERFACES;

EID: 51149121863     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ITHERM.2008.4544297     Document Type: Conference Paper

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